Touch sensor and display device

ABSTRACT

A touch sensor includes a base layer; a first electrode member that includes a plurality of first electrodes arranged on the base layer and electrically connected to each other along a first direction, each of the first electrodes including a first opening; a second electrode member that includes a plurality of second electrodes arranged on the base layer and electrically connected to each other along a second direction that intersects the first direction; a conductive member that includes a plurality of conductive patterns electrically connected to each other along the first direction; and a proximity detector that is electrically connected to the conductive member and configured to detect proximity of an object by receiving a proximity sensing signal from the conductive member. Each of the conductive patterns is located in the first opening of each of the first electrodes and spaced apart from each of the first electrodes, respectively.

This application claims the benefit of Korean Patent Application No.10-2018-0119141, filed on Oct. 5, 2018, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a touch sensor and a display device.

2. Description of the Related Art

An electronic device that provides images to a user such as asmartphone, a tablet personal computer (PC), a digital camera, anotebook computer, a navigation system, and a smart television includesa display device for displaying images. The display device may includevarious input devices in addition to a display panel that generates anddisplays images.

Recently, a touch sensor that recognizes a touch input of a user hasbeen widely applied to display devices mainly in smartphones and tabletPCs. Due to its convenience and enhanced interactivity with a user, thetouch sensor is quickly replacing conventional input devices such as akeypad.

Recent research is focused on integrating various types of sensors intoa touch sensor.

SUMMARY

Aspects of the present disclosure provide a touch sensor that can servealso as a proximity sensor.

However, aspects of the present disclosure are not restricted to theembodiments set forth herein. The above and other aspects of the presentdisclosure will become more apparent to one of ordinary skill in the artto which the present disclosure pertains by referencing the detaileddescription of the present disclosure given below.

An embodiment of a touch sensor includes a base layer; a first electrodemember that includes a plurality of first electrodes arranged on thebase layer along a first direction and electrically connected to eachother along the first direction, each first electrode including a firstopening; a second electrode member that includes a plurality of secondelectrodes arranged on the base layer along a second direction thatintersects the first direction and electrically connected to each otheralong the second direction; a conductive member that includes aplurality of conductive patterns electrically connected to each otheralong the first direction; and a proximity detector that is electricallyconnected to the conductive member and configured to detect proximity ofan object by receiving a proximity sensing signal from the conductivemember, wherein each of the plurality of conductive patterns is locatedin the first opening of each of the plurality of first electrodes andspaced apart from each of the plurality of first electrodes,respectively.

An embodiment of a touch sensor includes a base layer; a first electrodemember that includes a plurality of first electrodes arranged on thebase layer along a first direction and electrically connected to eachother along the first direction, each of the plurality of firstelectrodes including a first opening; a second electrode member thatincludes a plurality of second electrodes arranged on the base layeralong a second direction that intersects the first direction andelectrically connected to each other along the second direction, each ofthe plurality of second electrodes including a second opening; a firstconductive member that includes a plurality of first conductive patternselectrically connected to each other along the first direction; a secondconductive member that is spaced apart from the first conductive memberand includes a plurality of second conductive patterns electricallyconnected to each other along the first direction; and a proximitydetector that is electrically connected to the second conductive memberand configured to detect proximity of an object by receiving a proximitysensing signal from the second conductive member, wherein the secondelectrode member is provided in a plural number, and a plurality ofsecond electrode members is spaced apart from each other along the firstdirection, each of the plurality of first conductive patterns is locatedin the first opening of each of the plurality of first electrodes andspaced apart from each of the plurality of first electrodes,respectively, and each of the second conductive patterns is located inthe second opening of each of the plurality of second electrodes andspaced apart from each of the plurality of second electrodes,respectively.

An embodiment of a display device includes a base substrate; a lightemitting element that is located on the base substrate; a thin-filmencapsulation layer that is located on the light emitting element; aelectrode that is located on the thin-film encapsulation layer andincludes an opening; a conductive pattern that is located in the openingand spaced apart from the electrode; and a proximity detector that iselectrically connected to the conductive pattern and configured todetect proximity of an object by receiving a proximity sensing signalfrom the conductive pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1 is a schematic diagram of a touch sensor according to anembodiment and a display device including the touch sensor;

FIG. 2 is a block diagram of the touch sensor according to theembodiment illustrated in FIG. 1;

FIG. 3 illustrates the touch sensor of FIG. 2, a plan view of a sensingpart of the touch sensor, and the connection relationship between thesensing part and a touch controller;

FIG. 4 is an enlarged plan view of a portion Qa of FIG. 3;

FIG. 5 illustrates an exemplary structure of a first layer of thesensing part of FIG. 4;

FIG. 6 is an enlarged plan view of a portion Q1 of FIG. 5;

FIG. 7 is an enlarged plan view of a portion Q2 of FIG. 5;

FIG. 8 illustrates an exemplary structure of a second layer of thesensing part of FIG. 4;

FIG. 9 is a cross-sectional e en along X1-X1′ of FIG. 4;

FIG. 10 is a cross-sectional view taken along X2-X2′ of FIG. 4.

FIG. 11 illustrates an exemplary structure of a first layer according toa modified example of FIG. 5;

FIG. 12 illustrates an exemplary structure of a second layer accordingto a modified example of FIG. 8;

FIG. 13 is a cross-sectional view illustrating a modified example ofFIG. 9;

FIG. 14 is a cross-sectional view illustrating a modified example ofFIG. 10;

FIG. 15 illustrates an exemplary structure of a first layer according toa modified example of FIG. 5;

FIG. 16 illustrates an exemplary structure of a second layer accordingto a modified example of FIG. 8;

FIG. 17 is a cross-sectional view illustrating a modified example ofFIG. 9;

FIG. 18 is a cross-sectional view illustrating a modified example ofFIG. 10;

FIG. 19 is an enlarged plan view of a portion Q3 of FIG. 5;

FIG. 20 is a cross-sectional view taken along X3-X3′ of FIG. 19;

FIG. 21A is a diagram for explaining a touch position detectionoperation of the touch sensor according to an embodiment;

FIG. 21B is a diagram for explaining the operation of a switch circuitillustrated in FIG. 21A;

FIG. 22 specifically illustrates the connection relationship between thesensing part and the touch controller according to an embodiment;

FIG. 23 is a block diagram of a touch sensor according to an embodiment;

FIG. 24 illustrates the touch sensor of FIG. 23, a plan view of asensing part of the touch sensor, and the connection relationshipbetween the sensing part and a touch controller,

FIG. 25 is an enlarged plan view of a portion Qb of FIG. 24;

FIG. 26 illustrates an exemplary structure of a first layer of thesensing part of FIG. 25;

FIG. 27 illustrates an exemplary structure of a second layer of thesensing part of FIG. 25;

FIG. 28 is a cross-sectional view taken along X4-X4′ of FIG. 25;

FIG. 29 illustrates an exemplary structure of a first layer according toa modified example of FIG. 26;

FIG. 30 illustrates an exemplary structure of a second layer accordingto a modified example of FIG. 27:

FIG. 31 is a cross-sectional view illustrating a modified example ofFIG. 28;

FIG. 32 illustrates an exemplary structure of a first layer according toa modified example of FIG. 26:

FIG. 33 illustrates an exemplary structure of a second layer accordingto a modified example of FIG. 27;

FIG. 34 is a cross-sectional view illustrating a modified example ofFIG. 28;

FIG. 35 is a diagram for explaining a touch position detection operationof the touch sensor according to an embodiment;

FIG. 36 specifically illustrates the connection relationship between thesensing part and the touch controller according to an embodiment;

FIG. 37 is a diagram for explaining a touch position detection operationof a touch sensor according to an embodiment;

FIG. 38 specifically illustrates the connection relationship between asensing part and a touch controller according to an embodiment;

FIG. 39 is a diagram for explaining a touch position detection operationof a touch sensor according to an embodiment;

FIG. 40 specifically illustrates the connection relationship between asensing part and a touch controller according to an embodiment;

FIG. 41 is a block diagram of a touch sensor according to an embodiment;

FIG. 42 illustrates the touch sensor of FIG. 41, a plan view of asensing part of the touch sensor, and the connection relationshipbetween the sensing part and a touch controller,

FIG. 43 is an enlarged plan view of a portion Qc of FIG. 42;

FIG. 44 illustrates an exemplary structure of a first layer of thesensing part of FIG. 43;

FIG. 45 illustrates an exemplary structure of a second layer of thesensing part of FIG. 43;

FIG. 46 illustrates an exemplary structure of a third layer of thesensing part of FIG. 43;

FIG. 47 is a cross-sectional view taken along X5-X5′ of FIG. 43;

FIG. 48 illustrates an exemplary structure of a first layer according toa modified example of FIG. 44;

FIG. 49 illustrates an exemplary structure of a second layer accordingto a modified example of FIG. 45;

FIG. 50 illustrates an exemplary structure of a third layer according toa modified example of FIG. 46;

FIG. 51 is a cross-sectional view illustrating a modified example ofFIG. 47;

FIG. 52 illustrates an exemplary structure of a first layer according toa modified example of FIG. 44;

FIG. 53 illustrates an exemplary structure of a second layer accordingto a modified example of FIG. 45;

FIG. 54 illustrates an exemplary structure of a third layer according toa modified example of FIG. 46;

FIG. 55 is a cross-sectional view illustrating a modified example ofFIG. 47;

FIG. 56 is a diagram for explaining a touch position detection operationof the touch sensor according to an embodiment;

FIG. 57 specifically illustrates the connection relationship between thesensing part and the touch controller according to an embodiment;

FIG. 58 is a diagram for explaining a touch position detection operationof a touch sensor according to an embodiment;

FIG. 59 specifically illustrates the connection relationship between asensing part and a touch controller according to an embodiment;

FIG. 60 is a diagram for explaining a touch position detection operationof a touch sensor according to an embodiment;

FIG. 61 specifically illustrates the connection relationship between asensing part and a touch controller according to an embodiment;

FIG. 62 illustrates a modified example of FIG. 4;

FIG. 63 illustrates an exemplary structure of a first layer of a sensingpart of FIG. 62;

FIG. 64 illustrates an exemplary structure of a second layer of thesensing part of

FIG. 62;

FIG. 65 is a cross-sectional view taken along X1 a-X1 a′ of FIG. 62;

FIG. 66 is a cross-sectional view taken along X2 a-X2 a′ of FIG. 62;

FIG. 67 illustrates a modified example of FIG. 62;

FIG. 68 illustrates an exemplary structure of a first layer of a sensingpart of FIG. 67;

FIG. 69 illustrates an exemplary structure of a second layer of thesensing part of FIG. 67:

FIG. 70 is a cross-sectional view taken along X1 b-X1 b′ of FIG. 67:

FIG. 71 is a cross-sectional view taken along X2 b 1-X2 b 1′ of FIG. 67;

FIG. 72 is a cross-sectional view taken along X2 b 2-X2 b 2′ of FIG. 67;

FIG. 73 illustrates a modified example of FIG. 67;

FIG. 74 illustrates an exemplary structure of a first layer of a sensingpart of FIG. 73; and

FIG. 75 illustrates an exemplary structure of a second layer of thesensing part of FIG. 73.

DETAILED DESCRIPTION

Features of the inventive concept and methods of accomplishing the samemay be understood more readily by reference to the following detaileddescription of example embodiments and the accompanying drawings. Theinventive concept may, however, be embodied in many different forms andshould not be construed as being limited to the example embodiments setforth herein. Rather, these embodiments are provided so that the presentdisclosure will be thorough and complete and will fully convey theinventive concept to those skilled in the art. Like reference numeralsrefer to like elements throughout the specification unless the contextclearly indicates otherwise.

The terms used herein are for the purpose of describing particularembodiments only and are not intended to be limiting of the inventiveconcept. As used herein, the singular forms “a”, “an,” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises” and/or “comprising,” when used in the present specification,specify the presence of stated features, integers, steps, operations,elements, and/or components, but do not preclude the presence oraddition of one or more other features, integers, steps, operations,elements, components, and/or groups thereof.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror one or more intervening elements or layers may be present. Incontrast, when an element or layer is referred to as being “directlyon”, “directly connected to” or “directly coupled to” another element orlayer, there are no intervening elements or layers present. As usedherein, the term “and/or” includes any and all combinations of one ormore of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions,layers, and/or sections, these elements, components, regions, layers,and/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer, orsection from another element, component, region, layer, or section.Thus, a first element, component, region, layer, or section discussedbelow could be termed a second element, component, region, layer, orsection without departing from the teachings of the inventive concept.

Embodiments of the present disclosure may be described herein withreference to plan and/or cross-section views that are schematicillustrations of idealized embodiments of the present disclosure. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments of the present disclosure should not beconstrued as limited to the particular shapes of regions illustratedherein but are to include deviations in shapes that may result, forexample, from manufacturing. Thus, the regions illustrated in thedrawings are schematic in nature, and their shapes are not intended toillustrate the actual shape of a region of an element and are notintended to limit the scope of the present disclosure.

The size and thickness of each component illustrated in the drawings areillustrated for ease of description, and the present disclosure is notnecessarily limited to the sizes and thicknesses of the componentsillustrated in the drawings.

Hereinafter, example embodiments will be described with reference to theaccompanying drawings.

FIG. 1 is a schematic diagram of a display device 1 according to anembodiment, and FIG. 2 is a block diagram of a touch sensor TSMillustrated in FIG. 1.

Referring to FIGS. 1 and 2, the display device 1 according to theembodiment includes the touch sensor TSM and a display panel 300. Thedisplay device 1 may further include a display panel driver 400. Thetouch sensor TSM includes a sensing part 100 and a touch controller 200.

In FIG. 1, the sensing part 100 and the display panel 300 are shown tobe separated from each other. However, it is noted that this is just forease of description, and the sensing part 100 and the display panel 300may also be formed integrally with each other.

The display panel 300 includes a display area DA and a non-display areaNDA surrounding at least one side of the display area DA. The displayarea DA includes a plurality of scan lines 310, a plurality of datalines 320, and a plurality of pixels P connected to the scan lines 310and the data lines 320. The non-display area NDA may include wirings andsignal lines for carrying various driving and power signals for drivingthe pixels P.

In the present disclosure, the display panel 300 may be of varioustypes, and is not particularly limited to a particular type. Forexample, the display panel 300 may be a self-luminous display panel suchas an organic light emitting display panel including a plurality oforganic light emitting diodes (OLEDs), a quantum dot light emittingdisplay (QLED) panel, a micro-light emitting diode (LED) display panel,a nano-LED display panel. Alternatively, the display panel 300 may be anon-luminous display panel such as a liquid crystal display (LCD) panel,an electrophoretic display (EPD) panel, or an electrowetting display(EWD) panel. If the display panel 300 is a non-luminous display panel,the display device 1 may further include a backlight for supplying lightto the display panel 300. For ease of description, a case where thedisplay panel 300 is an organic light emitting display panel will bedescribed below as an example.

The display panel driver 400 is electrically connected to the displaypanel 300 to supply signals for driving the display panel 300. Forexample, the display panel driver 400 may include at least one of a scandriver for supplying scan signals to the scan lines 310, a data driverfor supplying data signals to the data lines 320, and a timingcontroller for supplying timing signals for driving the scan driver andthe data driver. According to an embodiment, the scan driver, the datadriver, and/or the timing controller may be integrated into a singledisplay integrated circuit (D-IC). Alternatively, in an embodiment, atleast one of the scan driver, the data driver, and the timing controllermay be integrated or mounted on the display panel 300.

The sensing part 100 may be provided on at least one area of the displaypanel 300. For example, the sensing part 100 may be provided on at leastone surface of the display panel 300 to at least partially overlap aportion of the display panel 300. For example, the sensing part 100 maybe disposed on a surface (e.g., an upper surface) of the display panel300 in a direction in which an image is displayed, between both surfaces(e.g., upper and lower surfaces) of the display panel 300.Alternatively, the sensing part 100 may be formed directly on at leastone of both surfaces of the display panel 300 or may be formed insidethe display panel 300. For example, the sensing part 100 may be formeddirectly on an outer surface of an upper substrate (or a thin-filmencapsulation layer) or a lower substrate (e.g., an upper surface of theupper substrate or a lower surface of the lower substrate) of thedisplay panel 300 or may be formed directly on an inner surface of theupper substrate or the lower substrate (e.g., a lower surface of theupper substrate or an upper surface of the lower substrate).

The sensing part 100 includes a sensing area SA and a peripheral areaNSA surrounding at least a part of the sensing area SA. In someembodiments, the sensing area SA may correspond to an area in which thesensing part 100 can sense a touch input, and the peripheral area NSAmay correspond to an area in which the sensing part 100 cannot sense atouch input. According to an embodiment, the sensing area SA maycorrespond to the display area DA of the display panel 300, and theperipheral area NSA may correspond to the non-display area NDA of thedisplay panel 300. For example, the sensing area SA of the sensing part100 may overlap the display area DA of the display panel 300, and theperipheral area NSA of the sensing part 100 may overlap the non-displayarea NDA of the display panel 300.

A plurality of first electrode members 120 and a plurality of secondelectrode members 130 for detecting a touch input may be provided in thesensing area SA of the sensing part 100.

The first electrode members 120 may extend along a first direction x andmay be spaced apart from each other along a second direction y thatintersects the first direction x. That is, the first electrode members120 extending in the first direction x may be spaced apart from eachother along the second direction y to form a plurality of electroderows.

The second electrode members 130 may extend along the second direction yand may be spaced apart from each other along the first direction x. Thesecond electrode members 130 may be spaced apart from the firstelectrode members 120 and may be insulated from the first electrodemembers 120. That is, the second electrode members 130 extending in thesecond direction y may be separated from each other along the firstdirection x to form a plurality of electrode columns.

The shapes, sizes, and/or arrangement directions of the first electrodemembers 120 and the second electrode members 130 are not particularlylimited to the present embodiment. As a non-limiting embodiment, thefirst electrode members 120 and the second electrode members 130 may beconfigured as illustrated in FIG. 3. The details of the embodimentillustrated in FIG. 3 will be described later.

The first electrode members 120 and the second electrode members 130 maybe electrically connected to the touch controller 200. In someembodiments, each of the second electrode members 130 may be a drivingelectrode member that receives a driving signal Ts for touch detectionfrom the touch controller 200, and each of the first electrode members120 may be a sensing electrode member that outputs a sensing signal Rsfor touch detection to the touch controller 200.

The first electrode members 120 and the second electrode members 130 mayoverlap at least one electrode of the display panel 300. For example,when the display panel 300 is an organic light emitting display panel,the first electrode members 120 and the second electrode members 130 mayoverlap a cathode of an organic light emitting diode (OLED) included inthe display panel 300.

A plurality of first conductive members 150 may be provided in thesensing area SA of the sensing part 100. Each of the first conductivemembers 150 may sense a noise generated by the sensing part 100according to an operation of a switch circuit 250 and provide the sensednoise to a touch detector 270 as a noise sensing signal Ns. In addition,each of the first conductive members 150 may provide a proximity sensingsignal Ps to a proximity detector 290 according to another operation ofthe switch circuit 250. The first conductive members 150 may be spacedapart from the first electrode members 120 and the second electrodemembers 130 and may be insulated from the first electrode members 120and the second electrode members 130.

In some embodiments, the first conductive members 150, like the firstelectrode members 120, may extend along the first direction x and may bespaced apart from each other along the second direction y thatintersects the first direction x. The first conductive members 150 willbe described in more detail later.

The touch controller 200 may be electrically connected to the sensingpart 100 to supply the driving signal Ts to the sensing part 100 and maydetect a touch position by receiving the sensing signal Rs correspondingto the driving signal Ts supplied by the sensing part 100. In addition,the touch controller 200 may be electrically connected to the firstconductive members 150 to detect whether an object is in proximity.

In some embodiments, the touch controller 200 may include a touch driver210, the touch detector 270, and the proximity detector 290. The touchcontroller 200 may further include the switch circuit 250 and anamplifying circuit 230.

The touch driver 210 may provide the driving signal Ts for detecting atouch input to each of the second electrode members 130.

The touch detector 270 may detect the presence or absence of a touchinput and/or the position of the touch input using the sensing signal Rscorresponding to the driving signal Ts received from each of the firstelectrode members 120 during a period in which a touch sensing operationis performed. In some embodiments, the sensing signal Rs may be a changein mutual capacitance between a first electrode member 120 and a secondelectrode member 130. More specifically, when a touch input occurs, themutual capacitance is changed at a position of the touch input and/oraround the position of the touch input. The touch detector 270 mayreceive the sensing signal Rs that indicates a change in mutualcapacitance between a first electrode member 120 and a second electrodemember 130 and detect the presence or absence and/or position of a touchinput based on the sensing signal Rs. In addition, the touch detector270 may receive the noise sensing signal Ns from each of the firstconductive members 150 and remove or cancel a noise component includedin the sensing signal Rs using the noise sensing signal Ns.

In some embodiments, the touch detector 270 may include at least oneamplifier for amplifying the sensing signal Rs, an analog-digitalconverter (ADC) connected to an output terminal of the amplifier, and aprocessor. These components of the touch detector 270 will be describedin more detail later with reference to FIGS. 21A and 22.

The proximity detector 290 is electrically connected to the firstconductive members 150 and receives the proximity sensing signal Ps fromeach of the first conductive members 150 to detect the proximity of anobject. In some embodiments, the proximity sensing signal Ps may includea signal that indicates a change in the self-capacitance of a firstconductive member 150 when an object is in proximity.

The switch circuit 250 may electrically connect the first conductivemembers 150 to one of the touch detector 270 and the proximity detector290. In some embodiments, the switch circuit 250 may electricallyconnect the first conductive members 150 to the touch detector 270during a first period in which the touch controller 200 performs a touchsensing operation. In addition, the switch circuit 250 may electricallyconnect the first conductive members 150 to the proximity detector 290during a second period in which the touch controller 200 performs aproximity sensing operation. That is, in some embodiments, the touchcontroller 200 may switch between two modes, for example, a touchsensing mode and a proximity sensing mode according to the operation ofthe switch circuit 250.

The amplifying circuit 230 is connected to the first conductive members150 and the touch detector 270 and may amplify the noise sensing signalNs provided by each of the first conductive members 150 or adjust a gainvalue of the noise sensing signal Ns. In some embodiments, theamplifying circuit 230 may be connected between the switch circuit 250and the touch detector 270. During the first period in which the touchcontroller 200 performs the touch sensing operation, the amplifyingcircuit 230 may be electrically connected to the first conductivemembers 150 and may amplify the noise sensing signal Ns received fromeach of the first conductive members 150 or adjust the gain value of thenoise sensing signal Ns and provide the amplified or gain value-adjustednoise sensing signal Ns to the touch detector 270.

In some embodiments, the touch driver 210, the touch detector 270, theproximity detector 290, the amplifying circuit 230, and the switchcircuit 250 may be integrated into a single touch IC.

In some embodiments, some of the touch driver 210, the touch detector270, the proximity detector 290, the amplifying circuit 230, and theswitch circuit 250 may be located in a position other than the inside ofthe touch IC.

The touch sensor TSM will now be described in more detail by referringto FIGS. 3 through 10.

FIG. 3 illustrates the touch sensor TSM of FIG. 2, a plan view of thesensing part 100 of the touch sensor TSM, and the connectionrelationship between the sensing part 100 and the touch controller 200.FIG. 4 is an enlarged plan view of a portion Qa of FIG. 3. FIG. 5illustrates an exemplary structure of a first layer L1 of the sensingpart 100 of FIG. 4. FIG. 6 is an enlarged plan view of a portion Q1 ofFIG. 5. FIG. 7 is an enlarged plan view of a portion Q2 of FIG. 5. FIG.8 illustrates an exemplary structure of a second layer L2 of the sensingpart 100 of FIG. 4 and a position of contact holes. FIG. 9 is across-sectional view taken along X1-X1′ of FIG. 4. FIG. 10 is across-sectional view taken along X2-X2′ of FIG. 4.

Referring to FIGS. 3 through 10, the sensing part 100 includes a baselayer 110, the first electrode members 120, the second electrode members130, and the first conductive members 150. The sensing part 100 mayfurther include conductors 171 as illustrated in FIGS. 3 and 4.

The base layer 110 may include the sensing area SA and the peripheralarea NSA. The base layer 110 may be a layer serving as a base of thesensing part 100. In some embodiments, the base layer 110 may be one ofthe layers constituting the display panel 300. In an embodiment in whichthe sensing part 100 and the display panel 300 are formed integrallywith each other, the base layer 110 may be at least one of the layersconstituting the display panel 300. For example, the base layer 110 maybe a thin-film encapsulation layer of the display panel 300.Alternatively, according to an embodiment, the base layer 110 may be arigid substrate or a flexible substrate. For example, the base layer 110may be a rigid substrate made of glass or tempered glass or a flexiblesubstrate made of a thin film of a flexible plastic material. A casewhere the base layer 110 is a layer including at least one of the layersconstituting the display panel 300 (e.g., the thin-film encapsulationlayer) will be described below as an example.

The first electrode members 120, the second electrode members 130, thefirst conductive members 150, and the conductors 171 may be located onthe sensing area SA of the base layer 110.

The first electrode members 120 may extend along the first direction xand may be spaced apart from each other along the second direction y asdescribed above. Each of the first electrode members 120 spaced apartfrom each other along the second direction y may form an electrode row.In FIG. 3, four first electrode members 120 are arranged along thesecond direction y to form four electrode rows. However, the presentdisclosure is not limited to this case, and the number of the firstelectrode members 120 can be variously changed.

Each of the first electrode members 120 may include a plurality of firstelectrodes 121 arranged along the first direction x and a plurality offirst connection portions 123, each connecting the first electrodes 121neighboring each other along the first direction x. In the followingdescription of embodiments, the term “connection” may encompass“connection” in physical and/or electrical aspects.

In some embodiments, as illustrated in FIG. 5, the first electrodes 121may be located in the first layer L1. The first electrodes 121 may havea rhombic shape or a square shape. However, the shape of the firstelectrodes 121 is not limited to the rhombic shape or the square shapeand can be changed to various shapes such as a triangle, aquadrilateral, a quadrilateral, a pentagon, a circle, and a bar.

The first electrodes 121 may include a conductive material. Examples ofthe conductive material may include metals and alloys of the metals.Examples of the metals may include gold (Au), silver (Ag), aluminum(Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni),neodymium (Nd), copper (Cu), and platinum (Pt). The first electrodes 121may also be made of a transparent conductive material. Examples of thetransparent conductive material may include silver nanowire (AgNW),indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide(AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO₂),carbon nanotube, and graphene.

In some embodiments, the first electrodes 121 may have a single-layerstructure or a multilayer structure. When the first electrodes 121 havea multilayer structure, the first electrodes 121 may include multiplemetal layers. For example, the first electrodes 121 may have athree-layer structure of Ti/Al/Ti.

In some embodiments, the first electrodes 121 may have a mesh structurethat is invisible to a user. When the first electrodes 121 have a meshstructure, they may be arranged not to overlap light emitting areas ofthe display panel 300. In other words, a mesh hole overlapping a lightemitting area may be defined in each of the first electrodes 121 thathas the mesh structure.

Each of the first electrodes 121 may include a first opening OP1. Forexample, at least a central portion of each of the first electrodes 121may be open to expose a layer located under the first electrode 121. Forexample, when an insulating layer IL is located under the firstelectrodes 121 as illustrated in FIG. 9, a portion of the insulatinglayer IL may be exposed through each of the first openings OP1. However,the present disclosure is not limited to this case, and some of thefirst electrodes 121 may not include the first opening OP1.

Each of the first connection portions 123 may contact and electricallyconnect the first electrodes 121 neighboring each other along the firstdirection x. In some embodiments, each of the first connection portions123 may be configured as a bridge-shaped connection pattern. In someembodiments, the first connection portions 123 may be located in thesecond layer L2 that is different from the first layer L1 in which thefirst electrodes 121 are located, as illustrated in FIG. 8.

In some embodiments, as illustrated in FIG. 9, the insulating layer ILmay be located between the first electrodes 121 and the first connectionportions 123. In some embodiments, the first connection portions 123that are located in the second layer L2 may be located on the base layer110, the insulating layer IL may be located on the first connectionportions 123, and the first electrodes 121 that are located in the firstlayer L1 may be located on the insulating layer IL. The first connectionportions 123 and the first electrodes 121 may be connected to anddirectly contact each other through first contact holes CH1 that areformed in the insulating layer IL.

The insulating layer IL may include an insulating material. In someembodiments, the insulating material may be an inorganic insulatingmaterial or an organic insulating material. The inorganic insulatingmaterial may include at least one of aluminum oxide, titanium oxide,silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.The organic insulating material may include at least one of acrylicresin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin,urethane resin, cellulose resin, siloxane resin, polyimide resin,polyamide resin, and perylene resin.

The first connection portions 123 may include a conductive material. Insome embodiments, the first connection portions 123 may include the samematerial as the first electrodes 121 or may include one or morematerials selected from the materials exemplified as the constituentmaterial of the first electrodes 121. In some embodiments, the firstconnection portions 123 may have a single-layer structure or amultilayer structure. For example, the first connection portions 123 mayhave a three-layer structure of Ti/Al/Ti. Alternatively, the firstconnection portions 123 may be made of a material that is different fromthe first electrodes 121.

In FIGS. 3 and 4, one first connection portion 123 is disposed betweentwo first electrodes 121 neighboring each other along the firstdirection x. However, the number of the first connection portions 123connecting two neighboring first electrodes 121 can be variouslychanged. For example, two or more first connection portions 123 may bedisposed between two first electrodes 121 neighboring each other alongthe first direction x.

The second electrode members 130 may extend along the second direction yand may be spaced apart from each other along the first direction x asdescribed above. Each of the second electrode members 130 spaced apartfrom each other along the first direction x may form an electrodecolumn. In FIG. 3, three second electrode members 130 are arranged alongthe first direction x to form three electrode columns. However, thepresent disclosure is not limited to this case, and the number of thesecond electrode members 130 can be variously changed.

Each of the second electrode members 130 may include a plurality ofsecond electrodes 131 arranged along the second direction y and aplurality of second connection portions 133, each electricallyconnecting the second electrodes 131 neighboring each other along thesecond direction y.

The second electrodes 131 may be electrically connected to each otheralong the second direction y. In addition, the second electrodes 131 maybe spaced apart from each other along the first direction x.

Each of the second electrodes 131 may include a second opening OP2. Forexample, at least a central portion of each of the second electrodes 131may be open to expose a layer located under the second electrode 131.For example, when the insulating layer IL is located under the secondelectrodes 131 as illustrated in FIG. 10, a portion of the insulatinglayer IL may be exposed through each of the second openings OP2.However, the present disclosure is not limited to this case, and some ofthe second electrodes 131 may not include the second opening OP2.

In some embodiments, in a plan view, the area of each of the secondopenings OP2 may be different from the area of each of the firstopenings OP1. For example, the area of each of the second openings OP2may be larger than the area of each of the first openings OP1.

In some embodiments, as illustrated in FIG. 5, the second electrodes 131may be located in the same first layer L1 as the first electrodes 121.The second electrodes 131 may have a rhombic planar shape. However, theplanar shape of the second electrodes 131 is not limited to the rhombicshape and can be changed to various shapes such as a triangle, aquadrilateral, a pentagon, a circle, and a bar.

Each of the second connection portions 133 may contact and electricallyconnect the second electrodes 131 neighboring each other along thesecond direction y. In some embodiments, the second connection portions133 may be located in the same first layer L1 as the first electrodes121 and the second electrodes 131, as illustrated in FIG. 5.

The second connection portions 133 may be insulated from the firstconnection portions 123 and may intersect the first connection portions123 in a plan view. In some embodiments, the insulating layer IL may belocated between the second connection portions 133 and the firstconnection portions 123 as illustrated in FIGS. 9 and 10.

The second electrodes 131 and the second connection portions 133 mayinclude a conductive material. In some embodiments, the secondelectrodes 131 and the second connection portions 133 may be made of thesame conductive material as the first electrodes 121.

In some embodiments, when the first electrodes 121 have a meshstructure, the second electrodes 131 may also have a mesh structure.

In some embodiments, each of the second electrodes 131 may be a touchdriving electrode that receives the driving signal Ts for detecting atouch input and the position of the touch input, and each of the firstelectrodes 121 may be a touch sensing electrode that outputs the sensingsignal Rs for detecting a touch input and the position of the touchinput.

The first conductive members 150 may be located in the electrode rowsformed by the first electrode members 120. In some embodiments, thefirst conductive members 150 may be located in the electrode rows formedby the first electrode members 120, respectively. Each of the firstconductive members 150 may output the noise sensing signal Ns or theproximity sensing signal Ps according to the operational mode of thetouch sensor TSM as described above.

Each of the first conductive members 150 may include a plurality offirst conductive patterns 151 and a plurality of first connection lines153.

The first conductive patterns 151 may be located within the firstopenings OP1 of the first electrodes 121, respectively, and may bespaced apart from the first electrodes 121. In some embodiments, asillustrated in FIG. 5, the first conductive patterns 151 may be locatedin the same first layer L1 as the first electrodes 121 and may be madeof the same material as the first electrodes 121.

In some embodiments, when the first electrodes 121 have a meshstructure, the first conductive patterns 151 may also have a meshstructure, as illustrated in FIG. 6.

Each of the first connection lines 153 may electrically connect thefirst conductive patterns 151 located in the same electrode row andneighboring each other along the first direction x. In some embodiments,as illustrated in FIG. 8, the first connection lines 153 may be locatedin the same second layer L2 as the first connection portions 123 and maybe made of the same material as the first connection portions 123.

In some embodiments, the first conductive patterns 151 and the firstconnection lines 153 may be connected to each other through secondcontact holes CH2 that are formed in the insulating layer IL.

The conductors 171 may be located within the second openings OP2 of thesecond electrodes 131, respectively. The second openings OP2 formed inthe second electrodes 131 may cause a difference in external lightreflectance. Accordingly, pattern stains may be visible from theoutside. The conductors 171 may reduce the difference in external lightreflectance, thereby reducing the occurrence of pattern stains that maybe visible from the outside.

The conductors 171 may be spaced apart from the second electrodes 131.In some embodiments, the conductors 171 may be in a floating state.

In some embodiments, the conductors 171 may have the same shape as thesecond openings OP2. For example, when the second openings OP2 arerhombic, the conductors 171 may also be rhombic.

The conductors 171 may be located in the same first layer L1 as thefirst electrodes 121, the second electrodes 131, and the firstconductive patterns 151 as illustrated in FIG. 5 and may be made of thesame material as one of the first electrodes 121, the second electrodes131, and the first conductive patterns 151.

In some embodiments, when the second electrodes 131 have a meshstructure, the conductors 171 may also have a mesh structure asillustrated in FIG. 7.

In some embodiments, in a plan view, the area of each of the firstopenings OP1 may be smaller than the area of each of the second openingsOP2. Accordingly, the area of each of the conductors 171 may be largerthan the area of each of the first conductive patterns 151.

In some embodiments, wirings 901, 903, 905, and 907 may be disposed onthe peripheral area NSA of the base layer 110 as illustrated in FIG. 3.

For example, the wirings 901, 903, 905, and 907 may include a thirdwiring 905 that is connected to each of the first electrode members 120,a first wiring 901 that is connected to an end of each of the secondelectrode members 130, a second wiring 903 that is connected to theother end of each of the second electrode members 130, and a fourthwiring 907 connected to each of the first conductive members 150. Here,the other end of each of the second electrode members 130 refers to anend that is opposite to an end of each second electrode member 130 towhich the first wiring 901 is connected. That is, a wiring connected toeach of the second electrode members 130 may have a double routingstructure, which can improve a resistive-capacitive (RC) delay caused bythe resistance of the second electrode members 130. However, the presentdisclosure is not limited to this case. For example, one of the firstwirings 901 and the second wirings 903 illustrated in FIG. 3 may beomitted. In an embodiment, a wiring connected to each of the secondelectrode members 130 may have a single routing structure.

Each of the first wiring 901 and the second wiring 903 may be providedin plural numbers, and the first wirings 901 and the second wirings 903may be connected to the second electrode members 130, respectively. Inaddition, the third wiring 905 may be provided in plural numbers, andthe third wirings 905 may be connected to the first electrode members120, respectively.

In some embodiments, only a single fourth wiring 907 may be provided,unlike the first wirings 901, the second wirings 903, and the thirdwirings 905. The single fourth wiring 907 may be connected to all of thefirst conductive members 150. Accordingly, the number of channels orpads allocated to the first conductive members 150 can be reduced, andthe area occupied by the fourth wiring 907 in the peripheral area NSAcan be reduced. In other embodiments, two or more fourth wirings 907 canalso be provided.

Pad portions TP1 and TP2 may be located on the peripheral area NSA ofthe base layer 110. The pad portions TP1 and TP2 may be electricallyconnected to the wirings 901, 903, 905 and 907, and the touch controller200 may be electrically connected to the pad portions TP1 and TP2.

In some embodiments, the pad portions TP1 and TP2 may include a firstpad portion TP1 and a second pad portion TP2 that are spaced apart fromeach other along the first direction x. The first pad portion TP1 may beconnected to the first wirings 901, the second wirings 903, and the oneor more fourth wirings 907, and the second pad portion TP2 may beconnected to the third wirings 905. However, the present disclosure isnot limited to this case. For example, the first pad portion TP1 and thesecond pad portion TP2 may form a single pad portion without beingspaced apart from each other. In addition, wirings connected to each ofthe first pad portion TP1 and the second pad portion TP2 can bevariously changed.

In the touch sensor TSM according to the above-described embodiment, thefirst electrodes 121, the second electrodes 131, the first conductivepatterns 151, and the conductors 171 that are located in the same firstlayer L1 can be simultaneously formed in the same process, thussimplifying a manufacturing process. In addition, since the firstelectrodes 121, the second electrodes 131, and the first conductivepatterns 151 are located in the same first layer L1, the touch sensorTSM can be implemented as a thin sensor while serving as a proximitysensor. Further, since the touch sensor TSM serves also as a proximitysensor, there is no need to form a layer and/or a hole for implementingthe proximity sensor in the display device 1.

In addition, the first connection lines 153 of the first conductivemembers 150 that are located in the same second layer L2 as the firstconnection portions 123 can be formed at the same time in the sameprocess, thus further simplifying the manufacturing process.

Furthermore, since each of the first conductive members 150 can outputthe noise sensing signal Ns during the touch sensing operation of thetouch sensor TSM, the touch sensor TSM can stably detect a touch input,and the sensing sensitivity of the touch sensor TSM can be improved.

However, the structure of the sensing part 100 is not limited to thatdescribed above.

FIG. 62 illustrates a modified example of FIG. 4. FIG. 63 illustrates anexemplary structure of a first layer L1′ of a sensing part of FIG. 62.FIG. 64 illustrates an exemplary structure of a second layer L2′ of thesensing part of FIG. 62. FIG. 65 is a cross-sectional view taken alongX1 a-X1 a′ of FIG. 62. FIG. 66 is a cross-sectional view taken along X2a-X2 a′ of FIG. 62.

Referring to FIGS. 62 through 66, in comparison to FIGS. 4, 5, 8, 9 and10, a first connection portion 123 of a first electrode member 120 maybe located in the same first layer L1′ as first electrodes 121 andsecond electrodes 131 and may be made of the same material as one of thefirst electrodes 121 and the second electrodes 131. In addition, asecond connection portion 133 of a second electrode member 130 may belocated in the same second layer L2′ as a first connection line 153 andmay be made of the same material as the first connection line 153. Thesecond connection portion 133 and the second electrodes 131 may beconnected to each other through contact holes CH1 a that are formed inan insulating layer IL.

In the current modified example, since the second connection portion 133is located in the second layer L2′, the first connection line 153 maybypass the second connection portion 133 and overlap a portion of asecond electrode 131 in a plan view.

Other components are the same as those described above with reference toFIGS. 4 through 10, and thus their description is omitted.

FIG. 67 illustrates a modified example of FIG. 62. FIG. 68 illustratesan exemplary structure of a first layer L1″ of a sensing part of FIG.67. FIG. 69 illustrates an exemplary structure of a second layer L2″ ofthe sensing part of FIG. 67. FIG. 70 is a cross-sectional view takenalong X1 b-X1 b′ of FIG. 67. FIG. 71 is a cross-sectional view takenalong X2 b 1-X2 b 1′ of FIG. 67. FIG. 72 is a cross-sectional view takenalong X2 b 2-X2 b 2′ of FIG. 67.

Referring to FIGS. 67 through 72, a second electrode member 130′ mayinclude second electrodes 131 and two second connection portions 1311and 1313, in comparison to FIG. 62. One of the two second connectionportions 1311 and 1313 is referred to as a first sub-connection portion1311, and the other is referred to as a second sub-connection portion1313. Each of the first sub-connection portion 1311 and the secondsub-connection portion 1313 may electrically connect the secondelectrodes 131 neighboring each other along the second direction y.

A first connection portion 123 of a first electrode member 120 may belocated in the same first layer L1″ as first electrodes 121 and thesecond electrodes 131 and may be made of the same material as one of thefirst electrodes 121 and the second electrodes 131.

The first sub-connection portion 1311 and the second sub-connectionportion 1313 may be located in the same second layer L2″ as a firstconnection line 153 and may be made of the same material as the firstconnection line 153.

The first sub-connection portion 1311 and the second electrodes 131 maybe connected to each other through contact holes CH1 al that are formedin an insulating layer IL. The second sub-connection portion 1313 andthe second electrodes 131 may be connected to each other through contactholes CH1 a 2 that are formed in the insulating layer IL.

In the current embodiment, neighboring second electrodes 131 areconnected to each other by two or more connection portions. Therefore,even if any one of the first sub-connection portion 1311 and the secondsub-connection portion 1313 is broken, the electrical connection betweenthe neighboring second electrodes 131 can be maintained by the otherone. This can improve connection reliability between the neighboringsecond electrodes 131.

Other components are the same as those described above with reference toFIGS. 4 through 10 and 62 through 66, and thus their description isomitted.

FIG. 73 illustrates a modified example of FIG. 67. FIG. 74 illustratesan exemplary structure of a first layer L1′″ of a sensing part of FIG.73. FIG. 75 illustrates an exemplary structure of a second layer L2″′ ofthe sensing part of FIG. 73.

Referring to FIGS. 73 through 75, a first conductive member 150′ mayinclude first conductive patterns 151 and two first connection lines1531 and 1533, in comparison to FIGS. 67 through 72. One of the twofirst connection lines 1531 and 1533 will be referred to as a firstsub-connection line 1531, and the other will be referred to as a secondsub-connection line 1533. Each of the first sub-connection line 1531 andthe second sub-connection line 1533 may electrically connect the firstconductive patterns 151 neighboring each other along the first directionx.

A first connection portion 123 of a first electrode member 120 may belocated in the same first layer L1″′ as first electrodes 121 and secondelectrodes 131 and may be made of the same material as one of the firstelectrodes 121 and the second electrodes 131.

A first sub-connection portion 1311, a second sub-connection portion1313, the first sub-connection line 1531, and the second sub-connectionline 1533 may be located in the same second layer L2″′ and may be madeof the same material.

The first sub-connection line 1531 and the first conductive patterns 151may be connected to each other through contact holes CH2 a that areformed in an insulating layer IL. In addition, the second sub-connectionline 1533 and the first conductive patterns 151 may be connected to eachother through contact holes CH2 b that are formed in the insulatinglayer IL.

In the current embodiment, neighboring first conductive patterns 151 areconnected to each other by two or more connection portions. Therefore,even if any one of the first sub-connection line 1531 and the secondsub-connection line 1533 is broken, the electrical connection betweenthe neighboring first conductive patterns 151 can be maintained by theother one. This can improve connection reliability between theneighboring first conductive patterns 151.

Other components are the same as those described above with reference toFIGS. 4 through 10 and 62 through 72, and thus their description isomitted.

In some embodiments, the structure of the touch sensor TSM, inparticular, the position of the first conductive patterns 151 and theposition of the first connection lines 153 may be variously changed, andthe position of the conductors 171 may also be variously changed.

Modified examples of the position of the first conductive patterns 151,the position of the first connection lines 153, and the position of theconductors 171 will now be described with respect to the embodiment ofFIGS. 4 through 10. In the modified examples described above withreference to FIGS. 62 through 75, the position of the first conductivepatterns 151, the position of the first connection lines 153, and theposition of the conductors 171 can be changed similarly to the followingdescription. In addition, the position of the first sub-connection line1531 and the position of the second sub-connection line 1533 describedabove with reference to FIGS. 73 through 75 can be changed similarly tothe position of the first connection lines 153 described below.

FIG. 11 illustrates an exemplary structure of a first layer L1 aaccording to a modified example of FIG. 5. FIG. 12 illustrates anexemplary structure of a second layer L2 a according to a modifiedexample of FIG. 8. FIG. 13 is a cross-sectional view illustrating amodified example of FIG. 9. FIG. 14 is a cross-sectional viewillustrating a modified example of FIG. 10.

Referring to FIGS. 11 through 14, in comparison to FIGS. 5, 8, 9, and10, a first conductive member 150 a may include first lower conductivepatterns 151 a and a first connection line 153.

The first lower conductive patterns 151 a may be located in a differentlayer from first electrodes 121 and second electrodes 131. For example,the first electrodes 121 and the second electrodes 131 may be located inthe first layer L1 a. In addition, the first lower conductive patterns151 a of the first conductive member 150 a may be located in the samesecond layer L2 a as a first connection portion 123 and the firstconnection line 153 of the first conductive member 150 a and may be madeof the same material as one of the first connection portion 123 and thefirst connection line 153. The first lower conductive patterns 151 a maybe connected to the first connection line 153 in the second layer L2 a.

In the current modified example, since the first lower conductivepatterns 151 a and the first connection line 153 of the first conductivemember 150 a are located in the same second layer L2 a, the secondcontact holes CH2 that are formed in the insulating layer IL illustratedin FIGS. 8 and 9 may be omitted.

In some embodiments, the conductors 171 may be omitted, and lowerconductors 171 a may be located in second openings OP2, in comparison toFIGS. 5, 8, 9, and 10. The lower conductors 171 a may be located in thesame second layer L2 a as the first connection portion 123 and the firstconnection line 153 of the first conductive member 150 a and may be madeof the same material as one of the first connection portion 123 and thefirst connection line 153.

FIG. 15 illustrates an exemplary structure of a first layer L1 baccording to a modified example of FIG. 5. FIG. 16 illustrates anexemplary structure of a second layer L2 b according to a modifiedexample of FIG. 8. FIG. 17 is a cross-sectional view illustrating amodified example of FIG. 9. FIG. 18 is a cross-sectional viewillustrating a modified example of FIG. 10.

Referring to FIGS. 15 through 18, in comparison to FIGS. 5, 8, 9, and10, a first conductive member 150 b may include first conductivepatterns 151, a first connection line 153, and first lower conductivepatterns 151 a.

The first conductive patterns 151 may be located in the same first layerL1 b as first electrodes 121 and second electrodes 131. In addition, thefirst lower conductive patterns 151 a and the first connection line 153of the first conductive member 150 b may be located in the same secondlayer L2 b as a first connection portion 123 and may be made of the samematerial as the first connection portion 123. The first lower conductivepatterns 151 a may be connected to the first connection line 153 in thesecond layer L2 b.

In some embodiments, the first lower conductive patterns 151 a and thefirst conductive patterns 151 may be connected to each other throughthird contact holes CH3 that are formed in an insulating layer IL.

In some embodiments, lower conductors 171 a may be further located insecond openings OP2, in comparison to FIGS. 5, 8, 9, and 10. The lowerconductors 171 a may be located in the same second layer L2 b as thefirst connection portion 123 and the first connection line 153, and maybe made of the same material as one of the first connection portion 123and the first connection line 153. In some embodiments, the lowerconductors 171 a may overlap conductors 171 in a plan view.

According to an embodiment, the base layer 110 that serves as the baseof the sensing part 100 may be a thin-film encapsulation layer of anorganic light emitting display panel. In this case, the base layer 110may be implemented as a multilayer including at least one organic layerand at least one inorganic layer or may be implemented as a single layerincluding a combination of organic and inorganic materials. For example,the base layer 110 may be a multilayer including at least two inorganiclayers and at least one organic layer interposed between the inorganiclayers. In a display device in which the base layer 110 is implementedas a thin-film encapsulation layer of an organic light emitting displaypanel, electrodes constituting the sensing part 100 and componentsconstituting the display panel 100 may be formed on different surfacesof the base layer 110.

FIG. 19 is an enlarged plan view of a portion Q3 of FIG. 5. FIG. 20 is across-sectional view of the sensing part 100 and the display panel 300taken along X3-X3′ of FIG. 19.

Referring to FIGS. 19 and 20, the sensing part 100 may include athin-film encapsulation layer of the display panel 300 (e.g., an organiclight emitting display panel) as the base layer 110. That is, thedisplay panel 300 and the sensing part 100 may be formed integrally witheach other. The same reference numeral will hereinafter be given to thebase layer 110 and the thin-film encapsulation layer indicating that thebase layer 110 corresponds to the thin-film encapsulation layer of thedisplay panel 300. For convenience, only a light emitting element OLED(e.g., an organic light emitting diode (OLED)) and one thin-filmtransistor TFT connected to the light emitting element OLED amongelements provided in each pixel of the display panel 300 are illustratedin FIG. 20.

The display panel 300 includes a base substrate 330, the light emittingelement OLED provided on a surface of the base substrate 330, and thethin-film encapsulation layer 110 provided on the light emitting elementOLED and covering at least a portion of the light emitting element OLED.In addition, according to an embodiment, the display panel 300 mayfurther include at least one thin-film transistor TFT connected to thelight emitting element OLED. The thin-film transistor TFT may be locatedbetween the base substrate 330 and the light emitting element OLED.

The display panel 300 may further include at least one power supplyline, a signal line, and/or a capacitor that are not illustrated in thedrawings.

According to an embodiment, the base substrate 330 may be a rigidsubstrate or a flexible substrate, and the material of the basesubstrate 330 is not particularly limited.

For example, the base substrate 330 may be a thin-film substrate havingflexible characteristics.

A buffer layer BFL is provided on a surface of the base substrate 330.The buffer layer BFL may prevent diffusion of impurities through thebase substrate 330 and improve the flatness of the base substrate 330.The buffer layer BFL may be provided as a single layer, but may also beprovided as a multilayer including at least two layers. The buffer layerBFL may be an inorganic insulating layer made of an inorganic material.For example, the buffer layer BFL may be made of silicon nitride,silicon oxide, or silicon oxynitride.

The thin-film transistor TFT is provided on the buffer layer BFL. Thethin-film transistor TFT includes an active layer ACT, a gate electrodeGE, a source electrode SE, and a drain electrode DE. According to anembodiment, the active layer ACT may be provided on the buffer layer BFLand may be made of a semiconductor material. For example, the activelayer ACT may be a semiconductor pattern made of polysilicon, amorphoussilicon, or an oxide semiconductor, one or more regions (e.g., regionsoverlapping the gate electrode GE and the drain electrode DE) of theactive layer ACT may not be doped with an impurity, and the other regionof the active layer ACT may be doped with an impurity.

A gate insulating layer GI may be provided on the active layer ACT, andthe gate electrode GE may be provided on the gate insulating layer GI.In addition, an interlayer insulating film ILA may be provided on thegate electrode GE, and the source electrode SE and the drain electrodeDE may be provided on the interlayer insulating film ILA. The sourceelectrode SE and the drain electrode DE may contact and be electricallyconnected to the active layer ACT respectively through contact holes CHAthat penetrate through the gate insulating layer GI and the interlayerinsulating film ILA.

According to an embodiment, a passivation layer PSV is provided on thesource electrode SE, the drain electrode DE, and the interlayerinsulating film ILA. The passivation layer PSV may cover the thin-filmtransistor TFT.

The light emitting element OLED is provided on the passivation layerPSV. The light emitting element OLED may include a first electrode EL1,a second electrode EL2, and a light emitting layer EML interposedbetween the first electrode EL1 and the second electrode EL2. Accordingto an embodiment, the first electrode EL1 of the light emitting elementOLED may be an anode. The first electrode EL1 of the light emittingelement OLED may contact and be electrically connected to an electrode(e.g., the drain electrode DE) of the thin-film transistor TFT through acontact hole CHB that penetrates through the passivation layer PSV.

A pixel defining layer PDL for defining a light emitting area PXA ofeach pixel is provided on the surface of the base substrate 330 on whichthe first electrode EL1 of the light emitting element OLED, etc. areformed. The pixel defining layer PDL may expose at least a portion of anupper surface of the first electrode EL1 and protrude from the basesubstrate 330 along the periphery of each pixel area.

The light emitting layer EML is provided in the light emitting area PXAdefined by the pixel defining layer PDL. For example, the light emittinglayer EML may be disposed on the exposed portion of the upper surface ofthe first electrode EL1. According to an embodiment, the light emittinglayer EML may have a multilayer thin-film structure including at least alight generation layer. For example, the light emitting layer EML mayinclude a hole injection layer, a hole transport layer, a lightgeneration layer, a hole blocking layer (HBL), an electron transportlayer (ETL), and an electron injection layer (EIL). According to anembodiment, the color of light generated by the light emitting layer EMLmay be one of red, green, and blue. Alternatively, the color of lightgenerated by the light emitting layer EML may be one of magenta, cyan,and yellow.

The second electrode EL2 of the light emitting element OLED may bedisposed on the light emitting layer EML. The second electrode EL2 ofthe light emitting element OLED may be a cathode.

The thin-film encapsulation layer 110 may be provided on the secondelectrode EL2 of the light emitting element OLED to cover the secondelectrode EL2 of the light emitting element OLED. The thin-filmencapsulation layer 110 may seal the light emitting element OLED. Thethin-film encapsulation layer 110 may include at least one inorganiclayer (hereinafter, referred to as an encapsulating inorganic layer).The thin-film encapsulation layer 110 may further include at least oneorganic layer (hereinafter, referred to as an encapsulating organiclayer). The encapsulating inorganic layer protects the light emittingelement OLED from moisture/oxygen, and the encapsulating organic layerprotects the light emitting element OLED from foreign matters such asdust particles. When the light emitting element OLED is scaled by thethin-film encapsulation layer 110, the thickness of the display device 1can be reduced, and impart flexible characteristics.

The thin-film encapsulation layer 110 may have a multilayer structure ora single-layer structure. For example, the thin-film encapsulation layer110 may include a first encapsulating inorganic layer 111, anencapsulating organic layer 112, and a second encapsulating inorganiclayer 113 that are sequentially stacked on the second electrode EL2.

In some embodiments, each of the first encapsulating inorganic layer 111and the second encapsulating inorganic layer 113 may be made of siliconnitride, aluminum nitride, zirconium nitride, titanium nitride, hafniumnitride, tantalum nitride, silicon oxide, aluminum oxide, titaniumoxide, tin oxide, cerium oxide, silicon oxynitride (SiON), or lithiumfluoride.

In some embodiments, the encapsulating organic layer 112 may be made ofacrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxyresin, urethane resin, cellulose resin, or perylene resin.

It is noted that the structure of the thin-film encapsulation layer 110is not limited to the above example, and the stacked structure of thethin-film encapsulation layer 110 can be variously changed.

The components of the second layer L2 of the touch sensor TSM describedabove may be disposed on the thin-film encapsulation layer 110. Theinsulating layer IL may be located on the second layer L2, and the firstlayer L1 of the touch sensor TSM may be located on the insulating layerIL. In FIG. 20, the first electrodes 121 are illustrated as componentsof the first layer L1. The first electrodes 121 may have a meshstructure that is invisible to a user as described above and may bedisposed not to overlap the light emitting areas PXA. In other words, amesh hole overlapping the light emitting area PXA may be defined in eachof the first electrodes 121 that has the mesh structure.

In the display device 1 according to the above-described embodiment, thedisplay panel 300 may be implemented as an organic light emittingdisplay panel having the thin-film encapsulation layer 110, and thecomponents of the sensing part 100 may be disposed on the thin-filmencapsulation layer 110.

A touch position detection operation of the touch sensor TSM will now bedescribed by referring to FIGS. 21A, 21B, and 22.

FIG. 21A is a diagram for explaining a touch position detectionoperation of the touch sensor TSM according to an embodiment. FIG. 21Bis a diagram for explaining the operation of a switch circuit 250illustrated in FIG. 21A. FIG. 22 specifically illustrates the connectionrelationship between the sensing part 100 and the touch controller 200according to an embodiment.

Referring to FIGS. 21A, 21B and 22, in some embodiments, the touchcontroller 200 may perform different operations during a first period T1and a second period T2. For example, the touch controller 200 mayperform a touch sensing operation based on a change in mutualcapacitance between each first electrode member 120 and each secondelectrode member 130 during the first period T1 and may perform aproximity sensing operation based on a change in the self-capacitance ofeach first conductive member 150 during the second period T2 that isdifferent from the first period T1. The operation of each component ofthe touch controller 200 will now be described in more detail.

The touch driver 210 may provide driving signal Ts to the secondelectrode members 130 through the first wirings 901 and the secondwirings 903. In some embodiments, the driving signal Ts may besequentially provided to each of the second electrode members 130. Insome embodiments, the touch driver 210 may provide the driving signal Tsto the second electrode members 130 only during the first period T1.During the second period T2, the touch driver 210 may not provide thedriving signal Ts or may provide a signal that is different from thedriving signal Ts.

The touch detector 270 may receive sensing signal Rs from each of thefirst electrode members 120 through the third wirings 905. In someembodiments, the sensing signal Rs may include about a signal thatindicates a change in mutual capacitance between a particular firstelectrode member 120 and its corresponding second electrode member 130as described above. When the driving signal Ts is provided to each ofthe second electrode members 130, mutual capacitance Cm is formedbetween each second electrode member 130 and each first electrode member120. When a touch event such as a touch input occurs, the mutualcapacitance Cm may change. Each of the first electrode members 120 mayoutput the sensing signal Rs corresponding to the driving signal Ts. andthe sensing signal Rs that is output from each of the first electrodemembers 120 may be input to the touch detector 270. In some embodiments,the sensing signal Rs may include about a signal that indicates thechange in the mutual capacitance Cm.

In some embodiments, the touch detector 270 may include a plurality ofsensing channels SC electrically connected to the first electrodemembers 120, respectively. In addition, the touch detector 270 mayinclude at least one ADC 273 connected to each of the sensing channelsSC and a processor 275. In the following description, the sensingchannel SC and the ADC 273 are described as separate components.However, in an embodiment, the ADC 273 may be included in each sensingchannel SC.

The sensing channels SC may receive the sensing signals Rs from thefirst electrode members 120, amplify the received sensing signals Rs.and output an amplified sensing signals. In some embodiments, each ofthe sensing channels SC may include an analog front-end including atleast one amplifier 271 such as an operational amplifier (OP amp).

The amplifier 271 may include a first input terminal 2711, a secondinput terminal 2713, and an output terminal 2715. According to anembodiment, the first input terminals 2711 of the amplifiers 271 (e.g.,inverting input terminals of OP amps) may be electrically connected tothe first electrode members 120 by the third wirings 905, and thesensing signals Rs may be input to the first input terminals 2711,respectively.

In some embodiments, the second input terminals 2713 of the amplifiers271 (e.g., non-inverting input terminals of the OP amps) may beelectrically connected to the first conductive members 150 or theamplifying circuit 230 by the fourth wiring 907, and the noise sensingsignals Ns may be provided to the second input terminals 2713 of theamplifiers 271, respectively. Accordingly, reference voltages of theamplifiers 271 may vary according to voltage variations of the firstconductive members 150, respectively. That is, reference potentials ofthe amplifiers 271 may vary according to potentials (voltage levels) ofthe first conductive members 150, respectively.

During the first period T1 in which a touch is sensed based on a changein mutual capacitance, the potential of each of the first conductivemembers 150 may vary according to a noise signal introduced from, forexample, the display panel 300 to the sensing part 100. For example, thepotential of each of the first conductive members 150 during the firstperiod T1 may vary according to a common mode noise introduced from, forexample, the display panel 300 to the sensing part 100.

Therefore, if the first conductive members 150 are further disposed inthe sensing area SA and the reference potentials of the amplifiers 271are changed using the noise sensing signals Ns that are sensed by thefirst conductive members 150 during the first period T1, the common modenoise introduced to the sensing part 100 can be canceled (oreliminated). Specifically, the first electrode members 120 and the firstconductive members 150 that are sensing electrode members may haveripples corresponding to each other in response to the common modenoise. In particular, since the first electrode members 120 and thefirst conductive members 150 extend in the same direction in the sensingarea SA and are arranged at positions corresponding to each other, theymay receive noise signals of the same or very similar shapes and/oramplitudes. In addition, the first electrode members 120 areelectrically connected to the first input terminals 2711 of theamplifiers 271 by the third wirings 905, and the first conductivemembers 150 are electrically connected to the second input terminals2713 of the amplifiers 271 by the fourth wirings 907 that are differentfrom the third wirings 905. Therefore, noise components (ripples)included in the sensing signals Rs provided from the first electrodemembers 120 can be effectively canceled. Accordingly, signals outputfrom the output terminals 2715 of the amplifiers 271 may benoise-canceled sensing signals.

In some embodiments, each of the sensing channels SC may further includea capacitor C and a reset switch SW that are connected in parallel toeach other between the first input terminal 2711 and the output terminal2715 of the amplifier 271.

In the above example, each of the amplifiers 271 is implemented as aninverting amplifier (i.e., the sensing signals Rs are subtracted fromthe noise sensing signals Ns). In an embodiment, each of the amplifiers271 may also be implemented as a non-inverting amplifier.

The output terminals 2715 of the amplifiers 271 may be electricallyconnected to the ADCs 273.

Each of the ADCs 273 may convert an input analog signal into a digitalsignal. According to an embodiment, the number of the ADCs 273 may beequal to the number of the first electrode members 120 so that the ADCs273 can correspond one-to-one to the first electrode members 120.Alternatively, in an embodiment, two or more of the first electrodemembers 120 may be configured to share a single ADC 273. In this case, aswitch circuit (not shown) for selecting a sensing channel of the sharedfirst electrode members may be further provided.

The processor 275 may process a converted signal (digital signal)received from each of the ADCs 273 and detect a touch input based on thesignal processing result. For example, the processor 275 maycomprehensively analyze a first sensing signal that is amplified by eachamplifier 271 and converted by each ADC 273 to detect an occurrence of atouch input and a position of the touch input. According to anembodiment, the processor 275 may be implemented as a microprocessor(MPU). In this case, a memory required for driving the processor 275 maybe additionally provided in the touch detector 270. However, theconfiguration of the processor 275 is not limited to this example. Inanother example, the processor 275 may be implemented as amicrocontroller (MCU).

The touch controller 200 may further include the amplifying circuit 230that is connected between the second input terminals 2713 of the sensingchannels SC and the first conductive members 150. According to anembodiment, the amplifying circuit 230 may include at least oneamplifier 231. According to an embodiment, the amplifier 231 may includea first input terminal 2311 that is commonly connected to the firstconductive members 150 by the fourth wirings 907 and a second inputterminal 2313 that is connected to an output terminal 2315 via at leastone resistor Ra. According to an embodiment, the first input terminal2311 and the second input terminal 2313 may be an inverting inputterminal and a non-inverting input terminal, respectively. Forreference, resistors Ra and Rb in FIG. 22 correspond to input and outputimpedances of the amplifier 231.

The amplifying circuit 230 may receive the noise sensing signals Ns fromthe first conductive members 150 via the fourth wirings 907, amplify thenoise sensing signals Ns to a gain value of the amplifier 231, andoutput the amplified noise signals to the sensing channels SC,respectively. Here, the magnitudes of the noise sensing signals Ns to beinput to the sensing channels SC can be easily adjusted by adjusting thegain value of the amplifying circuit 230. In some embodiments, the gainvalue of the amplifying circuit 230 may be adjusted such that noisecomponents included in the sensing signals Rs that are output from thefirst electrode members 120 can be effectively canceled in the sensingchannels SC.

In some embodiments, the amplifying circuit 230 may receive the noisesensing signals Ns from the first conductive members 150 during thefirst period T1 according to the operation of the switch circuit 250 andmay not receive the noise sensing signals Ns from the first conductivemembers 150 during the second period T2.

According to an embodiment, the amplifying circuit 230 may furtherinclude a plurality of variable resistors VR1 through VR4 that areconnected in parallel to one another between an output terminal 2315 ofthe amplifier 231 and a predetermined reference power source GND such asa ground power source. For example, the amplifying circuit 230 mayinclude a plurality of resistors VR1 through VR4 corresponding to thenumber of the sensing channels SC.

According to an embodiment, the sensing channels SC may respectively beconnected to different variable resistors VR1 through VR4 provided inthe amplifying circuit 230. For example, the second input terminal 2713of a first sensing channel SC located at the top in FIG. 22 may beconnected to the first variable resistor VR1, and the second inputterminal 2713 of a second sensing channel SC may be connected to thesecond variable resistor VR2. In addition, the second input terminal2713 of a third sensing channel SC may be connected to the thirdvariable resistor VR3, and the second input terminal 2713 of a fourthsensing channel SC may be connected to the fourth variable resistor VR4.

According to the above-described embodiment, the gain value of the noisesensing signal Ns that is input to the second input terminal 2713 of asensing channel SC may be independently adjusted according to themagnitude of a noise component included in the sensing signal Rs that isinput to the sensing channel SC. For example, the gain values of thenoise sensing signals Ns that are input to the sensing channels SCconnected to the first electrode members 120 may be differentiallyapplied according to the positions of the first electrode members 120.Among the electrode rows formed by the first electrode members 120 (anelectrode row located at the top in FIG. 22 is referred to as a firstelectrode row and an electrode row located at the bottom is referred toas a last electrode row), the magnitudes of the noise sensing signals Nsthat are input to the sensing part 100 may vary from the first electroderow toward the last electrode row. For example, when the magnitudes ofthe noise sensing signals Ns that are input to the sensing part 100gradually decrease from the first electrode row toward the lastelectrode row in the sensing area SA, the gain values of the noisesensing signals Ns may be gradually reduced from the first sensingchannel SC that is connected to the first sensing electrode member 120of the first electrode row toward the last sensing channel SC that isconnected to the first electrode member 120 of the last electrode row.Accordingly, the gain values of the noise sensing signals Ns can beindependently adjusted according to vertical positions (e.g., Ycoordinates) of the first electrode members 120 in the sensing part 100to more effectively cancel the noise components included in the sensingsignals Rs.

In addition, according to the above-described embodiment, during aperiod in which the second electrode members 130 are sequentiallydriven, the gain values of the noise sensing signals Ns may also beindependently adjusted in units of sub-periods during which each of thesecond electrode members 130 is driven by adjusting resistance values ofthe variable resistors VR1 through VR4 in units of sub-periods.Accordingly, a difference in the magnitude of noise between horizontalpositions (e.g., X coordinates) in the sensing part 100 can becompensated for. Therefore, according to the above-described embodiment,the noise components included in the sensing signals Rs can be moreaccurately and effectively canceled.

The switch circuit 250 may be connected to the first conductive members150, the amplifying circuit 230, and the proximity detector 290. Theswitch circuit 250 may include a switch 251 and a switch controller 253.

The switch 251 may connect the first conductive members 150 to eitherthe amplifying circuit 230 or the proximity detector 290. The switchcontroller 253 may control the operation of the switch 251 according toan operational mode.

In some embodiments, the switch 251 may be controlled by the switchcontroller 253 to connect the first conductive members 150 to theamplifying circuit 230 during the first period T1. As described above,the first period T1 may be a period during which the touch detector 270detects a touch input based on a change in mutual capacitance betweeneach first electrode member 120 and each second electrode member 130.The noise sensing signals Ns that are output from the first conductivemembers 150 during the first period T1 may be provided to the touchdetector 270 via the switch 251 and the amplifying circuit 230. Thetouch detector 270 may detect a touch position based on the sensingsignals Rs that are received from the first electrode members 120 andthe noise sensing signals Ns that are received from the first conductivemembers 150.

In addition, the switch 251 may be controlled by the switch controller253 to connect the first conductive members 150 to the proximitydetector 290 during the second period T2. As described above, the secondperiod T2 may be a period during which the proximity detector 290detects the proximity of an object based on a change in theself-capacitance of each of the first conductive members 150. Theproximity sensing signals Ps that are output from each of the firstconductive members 150 during the second period T2 may be provided tothe proximity detector 290 via the switch 251. The proximity detector290 may detect the proximity of an object based on the proximity sensingsignals Ps that are received from each of the first conductive members150.

In some embodiments, the switch circuit 250 may be implemented insoftware, firmware, or hardware.

The proximity detector 290 may be connected to the first conductivemembers 150 via the switch circuit 250 during the second period T2. Theproximity detector 290 may receive the proximity sensing signal Ps fromeach of the first conductive members 150 during the second period T2 anddetect the proximity of an object based on the proximity sensing signalsPs.

In some embodiments, the proximity detector 290 includes a switch 291, adriving power source Vpo, an amplifier 293 operating as a comparator, acomparative power source Vcp connected to the amplifier 293, and aprocessor 295.

The switch 291 may switch the connection between the first conductivemembers 150 and a first node N1 and the connection between the firstconductive members 150 and a third node N3. Here, the first node N1 isconnected to a first input terminal 2931 of the amplifier 293, and thethird node N3 is connected to the driving power source Vpo.

The driving power source Vpo may provide a driving voltage for proximitydetection to the first conductive members 150. An end of the drivingpower source Vpo may be connected to a second node N2 that is providedwith a reference power source GND, and the other end of the drivingpower source Vpo may be connected to the third node N3.

The comparative power source Vcp may provide a threshold voltage to theamplifier 293 to determine whether an object is in proximity. An end ofthe comparative power source Vcp may be connected to the second node N2provided with the reference power source GND, and the other end of thecomparative power source Vcp may be connected to a second input terminal2933 of the amplifier 293.

The amplifier 293 may include the first input terminal 2931, the secondinput terminal 2933, and an output terminal 2935. According to anembodiment, the first input terminal 2931 of the amplifier 293 (e.g., anon-inverting input terminal of an OP amp) may be connected to the firstnode N1 that is connected to the first conductive members 150 via theswitch 291, and the proximity sensing signal Ps may be input to thefirst input terminal 2931.

In some embodiments, the second input terminal 2933 of the amplifier 293(e.g., an inverting input terminal of the OP amp) may be connected tothe comparative power source Vcp. Accordingly, a high signal or a lowsignal may be output from the output terminal 2935 of the amplifier 293according to the magnitude relationship between the proximity sensingsignal Ps and the comparative power source Vcp.

The processor 295 may process a signal output from the amplifier 293 anddetect the proximity of an object according to the signal processingresult. According to an embodiment, the processor 295 may be implementedas an MPU.

During the second period T2, the switch 291 of the proximity detector290 may be connected to the third node N3. Accordingly, the drivingvoltage provided by the driving power source Vpo may be provided to eachof the first conductive members 150 via the switch 291, andself-capacitance may be formed in each of the first conductive members150. After the driving voltage is applied to each of the firstconductive members 150, the switch 291 may be connected to the firstnode N1. Accordingly, the proximity sensing signal Ps output from eachof the first conductive members 150 may be provided to the first inputterminal 2931 of the amplifier 293. The proximity sensing signal Ps mayinclude a signal indicating a change in the self-capacitance of a firstconductive member 150 that occurs when an object is in proximitythereof. Therefore, the proximity detector 290 can detect the proximityof an object by comparing the threshold voltage of the comparative powersource Vcp with the proximity sensing signal Ps.

In some embodiments, the proximity detector 290 may further include acapacitor Cr and a reset switch SWr that are connected in parallel toeach other between the first node N1 and the second node N2.

It is noted that the above-described structure of the proximity detector290 is only an example, and the present disclosure is not limited tothis structure. The components of the proximity detector 290 can also bevariously changed.

The touch sensor TSM according to the above-described embodiment caneffectively cancel a noise signal introduced from, for example, thedisplay panel 300 and improve a signal-to-noise ratio (SNR).Accordingly, the touch sensor TSM can stably detect a touch input byeffectively canceling the noise signal, and the sensing sensitivity ofthe touch sensor TSM can be improved.

In addition, since the touch sensor TSM according to the above-describedembodiment can detect the proximity of an object, the structure of thedisplay device 1 can be simplified, and there is no need to form a holefor an additional optical proximity sensor.

In some embodiments, the display device 1 may be pre-programmed toperform an operation depending on the proximity of an object sensed bythe touch sensor TSM. For example, the display device 1 may perform apre-programmed feature such as screen locking, screen-off operation,stopping a touch sensing operation of a touch sensor, applicationcalling, or call receiving.

FIG. 23 is a block diagram of a touch sensor TSM-1 according to anembodiment.

Referring to FIG. 23, the touch sensor TSM-1 according to the currentembodiment includes a touch controller 200-1 and a sensing part 100-1.

The touch controller 200-1 may include a touch driver 210, a touchdetector 270, a proximity detector 290, and an amplifying circuit 230.

The current embodiment is substantially the same as or similar to theembodiment of FIG. 2 except that the touch controller 200-1 of the touchsensor TSM-1 does not include a switch circuit, and the sensing part100-1 includes a second conductive member 180. Therefore, redundantdescription will be omitted, and differences will be mainly describedbelow.

A noise sensing signal Ns that is output from a first conductive member150 may be provided to the touch detector 270 via the amplifying circuit230.

The second conductive member 180 may be connected to the proximitydetector 290. The second conductive member 180 may provide a proximitysensing signal Ps to the proximity detector 290, and the proximitydetector 290 may detect the proximity of an object based on theproximity sensing signal Ps received from the second conductive member180.

FIG. 24 illustrates the touch sensor TSM-1 of FIG. 23, a plan view ofthe sensing part 100-1 of the touch sensor TSM-1, and the connectionrelationship between the sensing part 100-1 and the touch controller200-1. FIG. 25 is an enlarged plan view of a portion Qb of FIG. 24. FIG.26 illustrates an exemplary structure of a first layer L1-1 of thesensing part 100-1 of FIG. 25. FIG. 27 illustrates an exemplarystructure of a second layer L2-1 of the sensing part 100-1 of FIG. 25.FIG. 28 is a cross-sectional view taken along X4-X4′ of FIG. 25.

Referring to FIGS. 24 through 28, the sensing part 100-1 may furtherinclude a plurality of second conductive members 180 and may not includeconductors, in comparison to the embodiment of FIGS. 3 through 10.

Each of the second conductive members 180 may be located in an electroderow formed by second electrodes 131 neighboring each other along thefirst direction x. In some embodiments, the second conductive member 180may be located in each electrode row formed by the second electrodes131. Although the number of rows formed by the second electrodes 131 isfive in FIG. 24, the present disclosure is not limited to this case.

Each of the second conductive members 180 may output the proximitysensing signal Ps as described above.

Each of the second conductive members 180 may include second conductivepatterns 181 and second connection lines 183.

The second conductive patterns 181 may be located within second openingsOP2 of the second electrodes 131 and may be spaced apart from the secondelectrodes 131. In some embodiments, as illustrated in FIG. 26, thesecond conductive patterns 181 may be located in the same first layerL1-1 as first electrodes 121, the second electrodes 131, secondconnection portions 133, and first conductive patterns 151 and may bemade of the same material as one of the first electrodes 121, the secondelectrodes 131, the second connection portions 133, and the firstconductive patterns 151.

In some embodiments, when the second electrodes 131 have a meshstructure, the second conductive patterns 181 may also have a meshstructure. For example, the mesh structure of the second conductivepatterns 181 may be substantially the same as or similar to thestructure illustrated in FIG. 7.

Each of the second connection lines 183 may electrically connect thesecond conductive patterns 181 that are located in the same row andneighboring each other along the first direction x. In some embodiments,as illustrated in FIG. 27, the second connection lines 183 may belocated in the same second layer L2-1 as first connection portions 123and first connection lines 153 and may be made of the same material asone of the first connection portions 123 and the first connection lines153.

In some embodiments, the second conductive patterns 181 and the secondconnection lines 183 may be connected to each other through fourthcontact holes CH4 that are formed in an insulating layer IL.

One or more fifth wirings 909 that are connected to the secondconductive members 180 may be disposed in a peripheral area NSA of abase layer 110, in addition to first wirings 901, second wirings 903,third wirings 905 and fourth wirings 907.

In some embodiments, only a single fifth wiring 909 may be provided,unlike the first wirings 901, the second wirings 903, and the thirdwirings 905. In addition, the single fifth wiring 909 may be connectedto all of the second conductive members 180. Accordingly, the number ofchannels or pads allocated to the second conductive members 180 can bereduced, and the area occupied by the fifth wiring 909 in the peripheralarea NSA can be reduced. In other embodiments, two or more fifth wirings909 can also be provided.

In some embodiments, the one or more fifth wirings 909 may be connectedto a second pad portion TP2.

In the touch sensor TSM-1 according to the above-described embodiment,each of the first conductive members 150 outputs the noise sensingsignal Ns. and each of the second conductive members 180 outputs theproximity sensing signal Ps. Therefore, the proximity detector 290 ofthe touch controller 200-1 can detect the proximity of an object whilethe touch detector 270 of the touch controller 200-1 performs a touchinput detection operation. That is, the touch controller 200-1 canperform a touch detection operation and a proximity detection operationindependently without being driven in a time-division manner and cansimultaneously perform both the touch detection operation and theproximity detection operation. However, the present disclosure is notlimited to this case. In some embodiments, the touch controller 200-1may be driven in a time-division manner to perform the touch detectionoperation and the proximity detection operation in different periods.

In some embodiments, the structure of the touch sensor TSM-1, inparticular, the position of the first conductive patterns 151, theposition of the first connection lines 153, the position of the secondconductive patterns 181, and the position of the second connection lines183 may be variously changed.

FIG. 29 illustrates an exemplary structure of a first layer L1-1 aaccording to a modified example of FIG. 26. FIG. 30 illustrates anexemplary structure of a second layer L2-1 a according to a modifiedexample of FIG. 27. FIG. 31 is a cross-sectional view illustrating amodified example of FIG. 28.

Referring to FIGS. 29 through 31, in comparison to FIGS. 26 through 28,a first conductive member 150 a may include first lower conductivepatterns 151 a and a first connection line 153, and a second conductivemember 180 a may include a second lower conductive pattern 181 a andsecond connection lines 183.

The first conductive member 150 a is the same as that described abovewith reference to FIGS. 11 through 14, and thus its description isomitted.

The second lower conductive patterns 181 a may be located in a differentlayer from the first electrodes 121 and the second electrodes 131. Forexample, the first electrodes 121 and the second electrodes 131 may belocated in the first layer L1-1 a. In addition, the second lowerconductive patterns 181 a may be located in the same second layer L2-1 aas a first connection portion 123, the first connection line 153, andthe second connection lines 183 and may be made of the same material asone of the first connection portion 123, the first connection line 153,and the second connection lines 183. The second lower conductivepatterns 181 a may be connected to the second connection lines 183 inthe second layer L2-1 a.

In the current modified example, since the second lower conductivepatterns 181 a and the second connection lines 183 are located in thesame second layer L2-1 a, the contact holes CH4 illustrated in FIGS. 25,27, and 28 may be omitted.

FIG. 32 illustrates an exemplary structure of a first layer L1-1 baccording to a modified example of FIG. 26. FIG. 33 illustrates anexemplary structure of a second layer L2-1 b according to a modifiedexample of FIG. 27. FIG. 34 is a cross-sectional view illustrating amodified example of FIG. 28.

Referring to FIGS. 32 through 34, in comparison to FIGS. 26 through 28,each second conductive member 180 b may include a second conductivepattern 181, second connection lines 183, and a second lower conductivepattern 181 a.

The second conductive patterns 181 may be located in the same firstlayer L1-1 b as first electrodes 121, second electrodes 131, and firstconductive patterns 151. In addition, the second lower conductivepatterns 181 a and the second connection lines 183 may be located in thesame second layer L2-1 b as a first connection portion 123, first lowerconductive patterns 151 a, and a first connection line 153 and may bemade of the same material as one of the first connection portion 123,the first lower conductive patterns 151 a, and the first connection line153. The second lower conductive patterns 181 a may be connected to thesecond connection lines 183 in the second layer L2-1 b.

In some embodiments, the second lower conductive patterns 181 a and thesecond conductive patterns 181 may be connected to each other throughfifth contact holes CH5 that are formed in an insulating layer IL.

The first conductive patterns 151, the first lower conductive patterns151 a, and the first connection line 153 are the same as those describedabove with reference to FIGS. 15 through 18, and thus their detaileddescription is omitted.

FIG. 35 is a diagram for explaining a touch position detection operationof the touch sensor TSM-1 according to an embodiment. FIG. 36specifically illustrates the connection relationship between the sensingpart 100-1 and the touch controller 200-1 according to an embodiment.

Referring to FIGS. 35 and 36, the touch controller 200-1 may not operateby distinguishing between a first period and a second period, incomparison to the embodiment of FIGS. 21A and 22.

The noise sensing signal Ns may be output from each of the firstconductive members 150, and the proximity sensing signal Ps may beoutput from each of the second conductive members 180 that are separatefrom the first conductive members 150. That is, the sensing part 100-1may simultaneously output the noise sensing signals Ns and the proximitysensing signals Ps. Accordingly, the touch detector 270 may detect atouch input/touch position based on sensing signals Rs including asignal that indicates a change in mutual capacitance and the noisesensing signals Ns. In addition, the proximity detector 290 may providea driving voltage for proximity detection (or a driving voltage forforming self-capacitance) to each of the second conductive members 180and detect the proximity of an object by receiving the proximity sensingsignals Ps including a signal that indicates a change inself-capacitance from each of the second conductive members 180. Thatis, the touch controller 200-1 may simultaneously and independentlyperform both a touch sensing operation and a proximity sensingoperation.

However, the operation of the touch controller 200-1 is not limited tothat described above, and the touch controller 200-1 can also performthe touch sensing operation and the proximity sensing operationseparately.

FIG. 37 is a diagram for explaining a touch position detection operationof a touch sensor TSM-2 according to an embodiment. FIG. 38 specificallyillustrates the connection relationship between a sensing part 100-1 anda touch controller 200-2 according to an embodiment.

Referring to FIGS. 37 and 38, the touch sensor TSM-2 includes the touchcontroller 200-2 and the sensing part 100-1.

The structure of the sensor section 100-1 is the same as that describedabove with reference to FIGS. 24 through 36, and thus its description isomitted.

The current embodiment is substantially the same as or similar to theembodiment of FIGS. 35 and 36 except that the touch controller 200-2includes an amplifying circuit 230-1, and the amplifying circuit 230-1is connected to a proximity detector 290. Therefore, redundantdescription will be omitted.

The amplifying circuit 230-1 may include a plurality of variableresistors corresponding to the number of sensing channels SC, forexample, a first variable resistor VR1, a second variable resistor VR2,a third variable resistor VR3, a fourth variable resistor VR4, and afifth variable resistor VR5 that are connected to the proximity detector290. The fifth variable resistor VR5 may be connected between an outputterminal 2315 of an amplifier 231 and a predetermined reference powersource GND such as a ground power source and may be connected inparallel to the first variable resistor VR1, the second variableresistor VR2, the third variable resistor VR3, and the fourth variableresistor VR4.

According to an embodiment, a second node N2 of the proximity detector290 may be connected to the fifth variable resistor VR5 of theamplifying circuit 230-1, in comparison to the embodiment of FIGS. 35and 36.

According to the current embodiment, the proximity detector 290 mayreceive a noise sensing signal Ns from each of first conductive members150 via the amplifying circuit 230-1. Therefore, a reference voltage ofthe proximity detector 290 may vary according to the voltage variationof each of the first conductive members 150. Accordingly, a noisecomponent included in a proximity sensing signal Ps can be effectivelyremoved, resulting in improved proximity detection accuracy.

FIG. 39 is a diagram for explaining a touch position detection operationof a touch sensor TSM-3 according to an embodiment. FIG. 40 specificallyillustrates the connection relationship between a sensing part 100-1 anda touch controller 200-3 according to an embodiment.

Referring to FIGS. 39 and 40, the touch sensor TSM-3 includes the touchcontroller 200-3 and the sensing part 100-1.

The structure of the sensor section 100-1 is the same as that describedabove with reference to FIGS. 24 through 36, and thus its description isomitted.

The touch controller 200-3 includes a proximity detector 290-1 and anamplifying circuit 230-1 that are different from those of the embodimentof FIGS. 35 and 36.

The amplifying circuit 230-1 is substantially the same as that of theembodiment of FIGS. 37 and 38, and thus its description is omitted.

The proximity detector 290-1 may receive a proximity sensing signal Ps1from each of second conductive members 180 through a fifth wiring 909.The proximity sensing signal Ps1 may include a signal indicating achange in mutual capacitance between a second electrode member 130 and asecond conductive member 180. When a driving signal Ts is provided tothe second electrode members 130, mutual capacitance is formed betweeneach second electrode member 130 and each second conductive member 180.When a proximity event such as proximity of an object occurs, the mutualcapacitance between a second electrode member 130 and a secondconductive member 180 may change. Each of the second conductive members180 may output the proximity sensing signal Ps1 corresponding to thedriving signal Ts. and the proximity sensing signal Ps1 that is outputfrom each of the second conductive members 180 may be input to theproximity detector 290-1.

The proximity detector 290-1 may include a proximity sensing channelSCP, at least one ADC 294 that is connected to the proximity sensingchannel SCP, and a processor 296.

The proximity sensing channel SCP may receive the proximity sensingsignal Ps1 from each of the second conductive members 180, amplify thereceived proximity sensing signal Ps1, and output the amplifiedproximity sensing signal. In some embodiments, the proximity sensingchannel SCP may include an analog front-end including at least oneamplifier 292 such as an OP amp. In some embodiments, the proximitysensing channel SCP may have substantially the same structure as sensingchannels SC of a touch detector 270.

The amplifier 292 may include a first input terminal 2921, a secondinput terminal 2923, and an output terminal 2925. According to anembodiment, the first input terminal 2921 of the amplifier 292 (e.g., aninverting input terminal of an OP amplifier) may be electricallyconnected to the second conductive members 180 by the fifth wiring 909,and the proximity sensing signal Ps1 may be input to the first inputterminal 2921.

The second input terminal 2923 of the amplifier 292 (e.g., anon-inverting input terminal of the OP amp) may be electricallyconnected to the amplifying circuit 230-1, and a noise sensing signal Nsthat is output from each of first conductive members 150 may be providedto the second input terminal 2923 of the amplifier 292 via theamplifying circuit 230-1. Accordingly, reference voltages of amplifiers271 may vary according to voltage variations of the first conductivemembers 150, respectively. That is, reference potentials of theamplifiers 271 may vary according to potentials (voltage levels) of thefirst conductive members 150, respectively.

In some embodiments, the proximity sensing channel SCP may furtherinclude a capacitor Cr1 and a reset switch SWr1 that are connected inparallel to each other between the first input terminal 2921 and theoutput terminal 2925 of the amplifier 292.

In the above example, the amplifier 292 is implemented as an invertingamplifier. However, in an embodiment, the amplifier 292 may also beimplemented as a non-inverting amplifier.

The output terminal 2925 of the amplifier 292 may be electricallyconnected to the ADC 294, and the processor 296 may process a convertedsignal (digital signal) that is received from the ADC 294 and detect theproximity of an object based on the signal processing result. In someembodiments, the processor 296 may be implemented as an MPU.

According to the current embodiment, since the proximity sensing signalPs1 includes a signal that indicates a change in the mutual capacitanceof each of the second conductive members 180, the touch controller 200-3can perform a touch sensing operation and a proximity sensing operationsimultaneously.

FIG. 41 is a block diagram of a touch sensor TSM-4 according to anembodiment. FIG. 42 illustrates the touch sensor TSM-4 of FIG. 41, aplan view of a sensing part 100-2 of the touch sensor TSM-4, and theconnection relationship between the sensing part 100-2 and a touchcontroller 200-1. FIG. 43 is an enlarged plan view of a portion Qc ofFIG. 42. FIG. 44 illustrates an exemplary structure of a first layerL1-2 of the sensing part 100-2 of FIG. 43. FIG. 45 illustrates anexemplary structure of a second layer L2-2 of the sensing part 100-2 ofFIG. 43. FIG. 46 illustrates an exemplary structure of a third layerL3-2 of the sensing part 100-2 of FIG. 43. FIG. 47 is a cross-sectionalview taken along X5-X5′ of FIG. 43.

Referring to FIGS. 41 through 47, the touch sensor TSM-4 according tothe current embodiment includes the touch controller 200-1 and thesensing part 100-2.

The touch controller 200-1 is the same as that of the embodiment ofFIGS. 23, 35 and 36, and thus its description is omitted.

The sensing part 100-2 is substantially the same as the sensing part100-1 described above with reference to FIGS. 24 through 36 except thatit includes second conductive members 180-1 that have a differentstructure from the sensing part 100-1. Therefore, differences will bemainly described below.

Each of the second conductive members 180-1 may include secondconductive patterns 181, second connection lines 183, and thirdconnection lines 185.

The second conductive patterns 181 may be located within second openingsOP2 of second electrodes 131 and may be spaced apart from the secondelectrodes 131. In some embodiments, as illustrated in FIG. 44, thesecond conductive patterns 181 may be located in the same first layerL1-2 as first electrodes 121, the second electrodes 131, secondconnection portions 133, and first conductive patterns 151 and may bemade of the same material as one of the first electrodes 121, the secondelectrodes 131, the second connection portions 133, and the firstconductive patterns 151.

Each of the second connection lines 183 may electrically connect thesecond conductive patterns 181 located in the same electrode row andneighboring each other along the first direction x. In some embodiments,as illustrated in FIG. 45, the second connection lines 183 may belocated in the same second layer L2-2 as first connection portions 123and first connection lines 153 and may be made of the same material asone of the first connection portions 123 and the first connection lines153. The second conductive patterns 181 and the second connection lines183 may be connected to each other through fourth contact holes CH4 thatare formed in an insulating layer IL.

Each of the third connection lines 185 may electrically connect thesecond conductive patterns 181 neighboring each other along the seconddirection y. In some embodiments, as illustrated in FIG. 46, the thirdconnection lines 185 may be located in the third layer L3-2 that isdifferent from the first layer L1-2 and the second layer L2-2.

The third connection lines 185 may include a conductive material. Insome embodiments, each of the third connection lines 185 may have asingle-layer structure or a multilayer structure.

In some embodiments, an upper insulating layer UIL may be furtherlocated between the first layer L1-2 and the third layer L3-2, forexample, between the first and second electrodes 121 and 131 and thethird connection lines 185, and the third connection lines 185 may belocated on the upper insulating layer UIL. In some embodiments, thethird connection lines 185 may be connected to the second conductivepatterns 181 through sixth contact holes CH6 formed in the upperinsulating layer UIL.

In some embodiments, the upper insulating layer UIL may be disposedentirely above a base layer 110 as illustrated in FIG. 47.Alternatively, in an embodiment, the upper insulating layer UIL may bedisposed partially above the base layer 110, for example, in the form ofan island pattern.

In some embodiments, the upper insulating layer UIL may include at leastone of the insulating materials described above in the description ofthe insulating layer IL.

In some embodiments, the structure of the touch sensor TSM-4, inparticular, the position of the first conductive patterns 151, theposition of the first connection lines 153, the position of the secondconductive patterns 181, and the position of the second connection lines183 may be variously changed.

FIG. 48 illustrates an exemplary structure of a first layer L1-2 aaccording to a modified example of FIG. 44. FIG. 49 illustrates anexemplary structure of a second layer L2-2 a according to a modifiedexample of FIG. 45. FIG. 50 illustrates an exemplary structure of athird layer L3-2 a according to a modified example of FIG. 46. FIG. 51is a cross-sectional view illustrating a modified example of FIG. 47.

Referring to FIGS. 48 through 51, first electrodes 121, secondelectrodes 131, and a second connection portion 133 may be located inthe first layer L1-2 a, and a first connection portion 123, first lowerconductive patterns 151 a, a first connection line 153, second lowerconductive patterns 181 a, and second connection lines 183 may belocated in the second layer L2-2 a. In addition, third connection lines185 may be located in the third layer L3-2 a and may be connected to thesecond lower conductive patterns 181 a through seventh contact holes CH7that are formed in an insulating layer IL and an upper insulating layerUIL.

The first lower conductive patterns 151 a, the first connection line153, the second lower conductive patterns 181 a, and the secondconnection lines 183 are the same as those described above withreference to FIGS. 29 through 31, and thus their description is omitted.

FIG. 52 illustrates an exemplary structure of a first layer L1-2 baccording to a modified example of FIG. 44. FIG. 53 illustrates anexemplary structure of a second layer L2-2 b according to a modifiedexample of FIG. 45. FIG. 54 illustrates an exemplary structure of athird layer L3-2 b according to a modified example of FIG. 46. FIG. 55is a cross-sectional view illustrating a modified example of FIG. 47.

Referring to FIGS. 52 through 55, second conductive patterns 181 may belocated in the same first layer L1-2 b as first electrodes 121, secondelectrodes 131, and first conductive patterns 151. In addition, secondlower conductive patterns 181 a and second connection lines 183 may belocated in the same second layer L2-2 b as a first connection portion123, first lower conductive patterns 151 a, and a first connection line153 and may be made of the same material as one of the first connectionportion 123, the first lower conductive patterns 151 a, and the firstconnection line 153. The second lower conductive patterns 181 a may beconnected to the second connection lines 183 in the second layer L2-2 b.

In some embodiments, the second lower conductive patterns 181 a and thesecond conductive patterns 181 may be connected to each other throughfifth contact holes CH5 that are formed in an insulating layer IL.

Third connection lines 185 may be located in the third layer L3-2 b andmay be connected to the second conductive patterns 181 through sixthcontact holes CH6 that are formed in the upper insulating layer UIL.

FIG. 56 is a diagram for explaining a touch position detection operationof the touch sensor TSM-4 according to an embodiment. FIG. 57specifically illustrates the connection relationship between the sensingpart 100-2 and the touch controller 200-1 according to an embodiment.

Referring to FIGS. 56 and 57, a touch detector 270 may detect a touchinput/touch position by receiving a sensing signal Rs from each of firstelectrode members 120 and a noise sensing signal Ns from each of firstconductive members 150 or an amplifying circuit 230.

In addition, a proximity detector 290 may detect the proximity of anobject by receiving a proximity sensing signal Ps from each of thesecond conductive members 180-1, and the proximity sensing signal Ps mayinclude a signal that indicates a change in the self-capacitance of asecond conductive member 180-1.

Other components of the touch controller 200-1 are the same as those ofthe embodiment of FIGS. 35 and 36, and thus their description isomitted.

FIG. 58 is a diagram for explaining a touch position detection operationof a touch sensor TSM-5 according to an embodiment. FIG. 59 specificallyillustrates the connection relationship between a sensing part 100-2 anda touch controller 200-2 according to an embodiment.

Referring to FIGS. 58 and 59, a touch detector 270 may detect a touchinput/touch position by receiving a sensing signal Rs from each of firstelectrode members 120 and a noise sensing signal Ns from each of firstconductive members 150 or an amplifying circuit 230-1.

In addition, a proximity detector 290 may detect the proximity of anobject by receiving a proximity sensing signal Ps from each of secondconductive members 180-1 and the noise sensing signal Ns from each ofthe first conductive members 150 or the amplifying circuit 230-1. Theproximity sensing signal Ps may include a signal that indicates a changein the self-capacitance of a second conductive member 180-1 as describedabove.

Other components of the touch controller 200-2 are the same as those ofthe embodiment of FIGS. 37 and 38, and thus their description isomitted.

FIG. 60 is a diagram for explaining a touch position detection operationof a touch sensor TSM-6 according to an embodiment. FIG. 61 specificallyillustrates the connection relationship between a sensing part 100-2 anda touch controller 200-3 according to an embodiment.

Referring to FIGS. 60 and 61, a touch detector 270 may detect a touchinput/touch position by receiving a sensing signal Rs from each of firstelectrode members 120 and a noise sensing signal Ns from each of firstconductive members 150 or an amplifying circuit 230-1.

In addition, a proximity detector 290-1 may detect the proximity of anobject by receiving a proximity sensing signal Ps1 from each of secondconductive members 180-1 and the noise sensing signal Ns from each ofthe first conductive members 150 or the amplifying circuit 230-1. Theproximity sensing signal Ps1 may include a signal that indicates achange in mutual capacitance between a second electrode member 130 and asecond conductive member 180-1 as described above.

Other components of the touch controller 200-3 are the same as those ofthe embodiment of FIGS. 39 and 40, and thus their description isomitted.

In a touch sensor according to any of the above-described embodimentsand a display device including the touch sensor, the touch sensor candetect the proximity of an object, therefore an additional proximitysensor can be omitted. In addition, since conductive members are formedin the process of manufacturing touch electrodes and connectionportions, the thickness of the touch sensor may not be increased.

Further, since the touch sensor can cancel the noise introduced from,for example a display panel, the touch sensing sensitivity and theproximity sensing sensitivity of the touch sensor can be improved.

According to the foregoing embodiments, it is possible to provide atouch sensor that is capable of sensing not only a position of a touchinput but also the proximity of an object and a display device includingthe touch sensor.

However, the effects of the exemplary embodiments described herein arenot restricted to the one set forth herein. The above and other effectsof the embodiments will become more apparent to one of daily skill inthe art to which the embodiments pertain by referencing the claims.

What is claimed is:
 1. A touch sensor comprising: a base layer; a firstelectrode member that comprises a plurality of first electrodes arrangedon the base layer along a first direction and electrically connected toeach other along the first direction, each of the plurality of firstelectrodes comprising a first opening; a second electrode member thatcomprises a plurality of second electrodes arranged on the base layeralong a second direction that intersects the first direction andelectrically connected to each other along the second direction; aconductive member that comprises a plurality of conductive patternselectrically connected to each other along the first direction; a touchdetector that is connected to the first electrode member and configuredto detect a touch position by receiving a touch sensing signal from thefirst electrode member; a proximity detector that is electricallyconnected to the conductive member and configured to detect proximity ofan object by receiving a proximity sensing signal from the conductivemember; and a switch circuit that is connected to the conductive memberand configured to electrically connect the conductive member and thetouch detector during a first period and electrically connect theconductive member and the proximity detector during a second period thatis different from the first period, wherein each of the plurality ofconductive patterns is located in the first opening of each of theplurality of first electrodes and spaced apart from each of theplurality of first electrodes, respectively.
 2. The touch sensor ofclaim 1, wherein the touch detector is configured to receive a noisesensing signal from the conductive member during the first period andcancel a noise contained in the touch sensing signal based on the noisesensing signal.
 3. The touch sensor of claim 1, further comprising anamplifying circuit that is connected between the touch detector and theswitch circuit, wherein the amplifying circuit comprises an amplifierconnected to the switch circuit and a plurality of variable resistorsconnected in parallel to an output terminal of the amplifier.
 4. Thetouch sensor of claim 1, wherein the proximity sensing signal comprisesa signal that indicates self-capacitance of the conductive member, andthe touch sensing signal comprises a signal that indicates mutualcapacitance between the first electrode member and the second electrodemember.
 5. A touch sensor comprising: a base layer; a first electrodemember that comprises a plurality of first electrodes arranged on thebase layer along a first direction and electrically connected to eachother along the first direction, each of the plurality of firstelectrodes comprising a first opening; a second electrode member thatcomprises a plurality of second electrodes arranged on the base layeralong a second direction that intersects the first direction andelectrically connected to each other along the second direction; aconductive member that comprises a plurality of conductive patternselectrically connected to each other along the first direction; aproximity detector that is electrically connected to the conductivemember and configured to detect proximity of an object by receiving aproximity sensing signal from the conductive member, wherein each of theplurality of conductive patterns is located in the first opening of eachof the plurality of first electrodes and spaced apart from each of theplurality of first electrodes, respectively, and wherein the firstelectrode member further comprises a first connection portion thatconnects two first electrodes neighboring each other along the firstdirection among the plurality of first electrodes, the second electrodemember further comprises a second connection portion that connects twosecond electrodes neighboring each other along the second directionamong the plurality of second electrodes and is insulated from the firstconnection portion, and the conductive member further comprises aconnection line that connects two conductive patterns neighboring eachother along the first direction among the plurality of conductivepatterns, wherein the plurality of first electrodes, the plurality ofsecond electrodes, and the plurality of conductive patterns are locatedin a first layer, any one of the first connection portion and the secondconnection portion is located in a second layer that is different fromthe first layer, the other one of the first connection portion and thesecond connection portion is located in the first layer, and theconnection line is located in the second layer.
 6. The touch sensor ofclaim 5, further comprising an insulating layer that is located on thebase layer, wherein the connection line is located on the base layer,the insulating layer is located on the connection line, and theplurality of first electrodes, the plurality of second electrodes, andthe plurality of conductive patterns are located on the insulatinglayer.
 7. The touch sensor of claim 6, wherein the base layer comprisesa first encapsulating inorganic layer, an encapsulating organic layerlocated on the first encapsulating inorganic layer, a secondencapsulating inorganic layer located on the encapsulating organiclayer, and the connection line is located on the second encapsulatinginorganic layer.
 8. A touch sensor comprising: a base layer; a firstelectrode member that comprises a plurality of first electrodes arrangedon the base layer along a first direction and electrically connected toeach other along the first direction, each of the plurality of firstelectrodes comprising a first opening; a second electrode member thatcomprises a plurality of second electrodes arranged on the base layeralong a second direction that intersects the first direction andelectrically connected to each other along the second direction; aconductive member that comprises a plurality of conductive patternselectrically connected to each other along the first direction; aproximity detector that is electrically connected to the conductivemember and configured to detect proximity of an object by receiving aproximity sensing signal from the conductive member, wherein each of theplurality of conductive patterns is located in the first opening of eachof the plurality of first electrodes and spaced apart from each of theplurality of first electrodes, respectively, and wherein the firstelectrode member further comprises a first connection portion thatconnects two first electrodes neighboring each other along the firstdirection among the plurality of first electrodes, the second electrodemember further comprises a second connection portion that connects twosecond electrodes neighboring each other along the second directionamong the plurality of second electrodes and is insulated from the firstconnection portion, and the conductive member further comprises aconnection line that connects two conductive patterns neighboring eachother along the first direction among the plurality of conductivepatterns, wherein the plurality of first electrodes and the plurality ofsecond electrodes are located in a first layer, any one of the firstconnection portion and the second connection portion is located in asecond layer that is different from the first layer, the other one ofthe first connection portion and the second connection portion islocated in the first layer, and the plurality of conductive patterns andthe connection line are located in the second layer.
 9. A touch sensorcomprising: a base layer; a first electrode member that comprises aplurality of first electrodes arranged on the base layer along a firstdirection and electrically connected to each other along the firstdirection, each of the plurality of first electrodes comprising a firstopening; a second electrode member that comprises a plurality of secondelectrodes arranged on the base layer along a second direction thatintersects the first direction and electrically connected to each otheralong the second direction; a conductive member that comprises aplurality of conductive patterns electrically connected to each otheralong the first direction; a proximity detector that is electricallyconnected to the conductive member and configured to detect proximity ofan object by receiving a proximity sensing signal from the conductivemember, wherein each of the plurality of conductive patterns is locatedin the first opening of each of the plurality of first electrodes andspaced apart from each of the plurality of first electrodes,respectively, and wherein the conductive member further comprises aplurality of lower conductive patterns that is located in a differentlayer from the plurality of conductive patterns and overlaps theplurality of conductive patterns, and the plurality of lower conductivepatterns is electrically connected to the plurality of conductivepatterns.
 10. A touch sensor comprising: a base layer; a first electrodemember that comprises a plurality of first electrodes arranged on thebase layer along a first direction and electrically connected to eachother along the first direction, each of the plurality of firstelectrodes comprising a first opening; a second electrode member thatcomprises a plurality of second electrodes arranged on the base layeralong a second direction that intersects the first direction andelectrically connected to each other along the second direction; aconductive member that comprises a plurality of conductive patternselectrically connected to each other along the first direction; aproximity detector that is electrically connected to the conductivemember and configured to detect proximity of an object by receiving aproximity sensing signal from the conductive member, wherein each of theplurality of conductive patterns is located in the first opening of eachof the plurality of first electrodes and spaced apart from each of theplurality of first electrodes, respectively, and wherein each of theplurality of second electrodes comprises a second opening, and the areaof the second opening is larger than that of the first opening.
 11. Thetouch sensor of claim 10, further comprising a plurality of conductors,each of the plurality of conductors is located in the second opening ofeach of the plurality of second electrodes and spaced apart from each ofthe plurality of second electrodes, respectively, wherein the pluralityof conductors and the plurality of conductive patterns are made of asame material.
 12. A touch sensor comprising: a base layer; a firstelectrode member that comprises a plurality of first electrodes arrangedon the base layer along a first direction and electrically connected toeach other along the first direction, each of the plurality of firstelectrodes comprising a first opening; a second electrode member thatcomprises a plurality of second electrodes arranged on the base layeralong a second direction that intersects the first direction andelectrically connected to each other along the second direction, each ofthe plurality of second electrodes comprising a second opening; a firstconductive member that comprises a plurality of first conductivepatterns electrically connected to each other along the first direction;a second conductive member that is spaced apart from the firstconductive member and comprises a plurality of second conductivepatterns electrically connected to each other along the first direction;and a proximity detector that is electrically connected to the secondconductive member and configured to detect proximity of an object byreceiving a proximity sensing signal from the second conductive member,wherein the second electrode member is provided in a plural number, anda plurality of second electrode members is spaced apart from each otheralong the first direction, each of the plurality of first conductivepatterns is located in the first opening of each of the plurality offirst electrodes and spaced apart from each of the plurality of firstelectrodes, respectively, and each of the plurality of second conductivepatterns is located in the second opening of each of the plurality ofsecond electrodes and spaced apart from each of the plurality of secondelectrodes, respectively, and wherein the first conductive member iselectrically connected to the proximity detector, and the proximitydetector is configured to receive a noise sensing signal from the firstconductive member and cancel a noise contained in the proximity sensingsignal based on the noise sensing signal.
 13. The touch sensor of claim12, further comprising a touch detector that is electrically connectedto the first electrode member and the first conductive member andconfigured to receive a touch sensing signal from the first electrodemember and the noise sensing signal from the first conductive member andcancel a noise contained in the touch sensing signal based on the noisesensing signal.
 14. The touch sensor of claim 13, further comprising anamplifying circuit that is connected between the touch detector and thefirst conductive member, wherein the amplifying circuit is furtherconnected to the proximity detector.
 15. The touch sensor of claim 12,wherein the proximity sensing signal comprises a signal that indicatesself-capacitance of the second conductive member.
 16. The touch sensorof claim 12, wherein the proximity sensing signal comprises a signalthat indicates mutual capacitance between the second conductive memberand the second electrode member.
 17. The touch sensor of claim 12,wherein the plurality of first conductive patterns and the plurality ofsecond conductive patterns are located in a same layer.
 18. A touchsensor comprising: a base layer; a first electrode member that comprisesa plurality of first electrodes arranged on the base layer along a firstdirection and electrically connected to each other along the firstdirection, each of the plurality of first electrodes comprising a firstopening; a second electrode member that comprises a plurality of secondelectrodes arranged on the base layer along a second direction thatintersects the first direction and electrically connected to each otheralong the second direction, each of the plurality of second electrodescomprising a second opening; a first conductive member that comprises aplurality of first conductive patterns electrically connected to eachother along the first direction; a second conductive member that isspaced apart from the first conductive member and comprises a pluralityof second conductive patterns electrically connected to each other alongthe first direction; and a proximity detector that is electricallyconnected to the second conductive member and configured to detectproximity of an object by receiving a proximity sensing signal from thesecond conductive member, wherein the second electrode member isprovided in a plural number, and a plurality of second electrode membersis spaced apart from each other along the first direction, each of theplurality of first conductive patterns is located in the first openingof each of the plurality of first electrodes and spaced apart from eachof the plurality of first electrodes, respectively, and each of theplurality of second conductive patterns is located in the second openingof each of the plurality of second electrodes and spaced apart from eachof the plurality of second electrodes, respectively, and wherein thefirst electrode member further comprises a first connection portion thatconnects two first electrodes neighboring each other along the firstdirection among the plurality of first electrodes, the second electrodemember further comprises a second connection portion that connects twosecond electrodes neighboring each other along the second directionamong the plurality of second electrodes and is insulated from the firstconnection portion, the first conductive member further comprises afirst connection line that connects two first conductive patternsneighboring each other along the first direction among the plurality offirst conductive patterns, and the second conductive member furthercomprises a second connection line that connects two second conductivepatterns neighboring each other along the first direction among theplurality of second conductive patterns, wherein the plurality of firstelectrodes, the plurality of second electrodes, the plurality of firstconductive patterns, and the plurality of second conductive patterns arelocated in a first layer, any one of the first connection portion andthe second connection portion is located in a second layer that isdifferent from the first layer, the other one of the first connectionportion and the second connection portion is located in the first layer,and the first connection line and the second connection line are locatedin the second layer.
 19. The touch sensor of claim 18, furthercomprising an insulating layer that is located on the base layer,wherein the first connection line and the second connection line arelocated on the base layer, the insulating layer is located on the firstconnection line and the second connection line, and the plurality offirst electrodes, the plurality of second electrodes, the plurality offirst conductive patterns, and the plurality of second conductivepatterns are located on the insulating layer.
 20. The touch sensor ofclaim 19, wherein the second conductive member further comprises a thirdconnection line that connects two second conductive patterns neighboringeach other along the second direction among the plurality of secondconductive patterns, and the third connection line is located in a thirdlayer that is different from the first layer and the second layer. 21.The touch sensor of claim 20, further comprising an upper insulatinglayer that is located on the plurality of second conductive patterns,wherein the third connection line is located on the upper insulatinglayer.
 22. A touch sensor comprising: a base layer; a first electrodemember that comprises a plurality of first electrodes arranged on thebase layer along a first direction and electrically connected to eachother along the first direction, each of the plurality of firstelectrodes comprising a first opening; a second electrode member thatcomprises a plurality of second electrodes arranged on the base layeralong a second direction that intersects the first direction andelectrically connected to each other along the second direction, each ofthe plurality of second electrodes comprising a second opening; a firstconductive member that comprises a plurality of first conductivepatterns electrically connected to each other along the first direction;a second conductive member that is spaced apart from the firstconductive member and comprises a plurality of second conductivepatterns electrically connected to each other along the first direction;and a proximity detector that is electrically connected to the secondconductive member and configured to detect proximity of an object byreceiving a proximity sensing signal from the second conductive member,wherein the second electrode member is provided in a plural number, anda plurality of second electrode members is spaced apart from each otheralong the first direction, each of the plurality of first conductivepatterns is located in the first opening of each of the plurality offirst electrodes and spaced apart from each of the plurality of firstelectrodes, respectively, and each of the plurality of second conductivepatterns is located in the second opening of each of the plurality ofsecond electrodes and spaced apart from each of the plurality of secondelectrodes, respectively, and wherein the first electrode member furthercomprises a first connection portion that connects two first electrodesneighboring each other along the first direction among the plurality offirst electrodes, the second electrode member further comprises a secondconnection portion that connects two second electrodes neighboring eachother along the second direction among the plurality of secondelectrodes and is insulated from the first connection portion, the firstconductive member further comprises a first connection line thatconnects two first conductive patterns neighboring each other along thefirst direction among the plurality of first conductive patterns, andthe second conductive member further comprises a second connection linethat connects two second conductive patterns neighboring each otheralong the first direction among the plurality of second conductivepatterns, wherein the plurality of first electrodes and the plurality ofsecond electrodes are located in a first layer, any one of the firstconnection portion and the second connection portion is located in asecond layer that is different from the first layer, the other one ofthe first connection portion and the second connection portion islocated in the first layer, and the plurality of first conductivepatterns, the plurality of second conductive patterns, the firstconnection line, and the second connection line are located in thesecond layer.
 23. A display device comprising: a base substrate; a lightemitting element that is located on the base substrate; a thin-filmencapsulation layer that is located on the light emitting element; anelectrode that is located on the thin-film encapsulation layer andcomprises an opening; a conductive pattern that is located in theopening and spaced apart from the electrode; a touch detector that isconnected to the electrode and configured to detect a touch input duringa first period; and a proximity detector that is configured to detectproximity of an object by electrically switching to connect to theconductive pattern and receiving a proximity sensing signal from theconductive pattern during a second period that is different from thefirst period, wherein the proximity detector is electrically switched todisconnect from the conductive pattern during the first period.